N58 Hardware User Guide
Chapter 8 Mechanical Characteristics
Copyright © Neoway Technology Co., Ltd. All rights reserved.
Reel details
8.3.2 Moisture
N58 is a level-3 moisture sensitive device, in compliance with standard IPC/JEDEC J-STD-020. Pay
attention to all the related requirements for using this kind of components.
After the module is unpacked, if it is exposed to the air for a long time, the module will be moist, and
the module may be damaged during reflow soldering or welding in a lab. It is recommended that the
module exposed to the air for a long time should be baked before it can be used again. The baking
conditions are determined based on the moisture condition. It is recommended to bake the module at
a temperature higher than 90 degrees for more than 12 hours. In addition, since the tape is of non-high
temperature resistant material, the module cannot be baked directly on the tape.
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