Nvidia Jetson Orin NX Series - Page 67

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PRELIMINARY INFORMATION
Jetson Orin NX Series and Jetson Orin Nano Series DG-10931-001_v1.1 | 56
Parameter
Requirement
Units
Notes
Choke between RPD and FET choke
Max trace Rdc
Max trace length
600 or
1
20
4
uH@DC-100MHz
m
mm
Can be choke or Trace. Recommended
option for HDMI2.0 HF1-9 improvement.
Void
GND/PWR void under/above cap is
preferred
Common-mode Choke (Not recommended only used if absolutely required for EMI issues)
See Chapter 17 for details on CMC if implemented.
ESD (On-chip protection diode can withstand 2kV HMM. External ESD is optional. Designs should include ESD footprint as a stuffing
option)
Max junction capacitance
(IO to GND)
0.35
pF
e.g. Texas Instruments
TPD4E02B04DQAR
Footprint
Pad right on the net instead of trace
stub
Location
After pull-down resistor/CMC and
before RS
Void
GND/PWR void under/above the cap is
needed. Void size = 1 mm x 2 mm for
one pair
Series Resistor (RS): Series resistor on P/N path for HDMI 2.0 but not required for HDMI 2.1 (Mandatory to meet HDMI 2.0
Compliance).
Value
6
± 10%. 0ohm is acceptable if the design
passes the HDMI2.0 HF1-9 test.
Otherwise, adjust the RS value to ensure
the HDMI2.0 tests pass: Eye diagram,
Vlow test and HF1-9 TDR test
Location
After all components and before HDMI
connector
Void
GND/PWR void under/above the RS device is needed. Void size = SMT area + 1x
dielectric height keepout distance.
Trace at Component Region
Value
100
± 10%
Location
At component region (Microstrip)
Trace entering the SMT pad
One 45°
Trace between components
Uncoupled structure
HDMI connector
Connector voiding
Voiding the ground below the signal
lanes 0.1448 (5.7 mil) larger than the
pin itself