ST STM32F4 Series Getting Started

Package AN4488
18/44 DocID026304 Rev 3
3 Package
3.1 Package Selection
Package should be selected by taking into account the constrains that are strongly
dependent upon the application.
The list below summarizes the more frequent ones:
– Amount of interfaces required.
Some interfaces might not be available on some packages.
Some interfaces combinations could not be possible on some packages
– PCB technology constrains.
Small pitch and high ball density could require more PCB layers and higher class
PCB
– Package height
– PCB available area
– Noise emission or signal integrity of high speed interfaces.
Smaller packages usually provide better signal integrity. This is further enhanced
as Small pitch and high ball density requires multilayer PCBs which allow better
supply/ground distribution.
– Compatibility with other devices.
Table 4. Package summary (Excluding WCSP)
Size (mm)
(1)
7 x 7
10 x 10 14 x 14
7 x 7
20 x 20
7 x 7
10 x 10 24 x 24
7 x 7
10 x 10 28 x 28 13 x 13
Pitch (mm) 0.5 0.5 0.5 0.5 0.5 0.5 0.8 0.5 0.5 0.65 0.5 0.8
Height (mm) 0.6 1.6 1.6 0.6 1.6 0.6 0.6 1.6 0.6 0.6 1.6 1.1
Sales numbers
UFQFPN48
LQFP64
LQFP100
UFBGA100
LQFP144
UFBGA144 (0.5)
UFBGA144(0.8)
LQFP176
UFBGA169
UFBGA176+25
LQFP208
TFBGA216
STM32F405xx / 407xx
/ 415xx / 417xx
-XX-X- -X-X- -
STM32F42xxx / 43xxx - - X - X - - XXXXX
STM32F401xB/C XXXX --------
STM32F401xD/E XXXX --------
STM32F411xx XXXX - -----
STM32F446XX -XX-XXX-----
1. body size, excluding pins

ST STM32F4 Series Specifications

General

Brand	ST
Model	STM32F4 Series
Category	Computer Hardware
Language	English