Supermicro X11DPL-i User Manual

26
X11DPL-i User's Manual
Overview of the Processor Heatsink Module (PHM)
The processor heatsink module (PHM) contains 1) a passive heatsink, 2) a CPU/heatsink
carrier, and 3) Intel Xeon Scalable-SP or 2nd Gen Intel Xeon Scalable-SP processor.
1. Passive Heatsink
2. CPU/Heatsink Carrier
3. Intel Processor
Processor Heatsink Module (PHM)
(Bottom View)

Supermicro X11DPL-i Specifications

General

USB 2.0 ports quantity	4
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	3
Supported DIMM module capacities	64GB, 128MB
Memory voltage	1.2 V
Supported memory types	DDR4-SDRAM
Maximum internal memory	128 GB
Supported memory clock speeds	2133, 2400, 2666 MHz
RAID levels	0, 1, 5, 10
Wi-Fi	No
Ethernet LAN	Yes
Ethernet interface type	Gigabit Ethernet
System bus rate	10.4 GT/s
Processor manufacturer	Intel
Processor thermal power (max)	140 W
PCI Express x16 (Gen 3.x) slots	2
BIOS type	UEFI AMI
Motherboard chipset	Intel® C621
Motherboard form factor	ATX
Harmonized System (HS) code	84733020

Weight and Dimensions

Depth	257.8 mm
Width	306.7 mm