Supermicro X11DPL-i User Manual

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X11DPL-i User's Manual
DIMM Population Guidelines for Optimal Performance
For optimal memory performance, follow the instructions listed in the tables below when
populating memory modules.
Key Parameters for DIMM Configuration
Key Parameters for DIMM Congurations
Parameters Possible Values
Number of Channels 1, 2, 3, 4, 5, or 6
Number of DIMMs per Channel 1DPC (1 DIMM Per Channel) or 2DPC (2 DIMMs Per Channel)
DIMM Type RDIMM (w/ECC), 3DS RDIMM, LRDIMM, 3DS LRDIMM
DIMM Construction • non-3DS RDIMM Raw Cards: A/B (2RX4), C (1RX4), D (1RX8), E (2RX8)
• 3DS RDIMM Raw Cards: A/B (4RX4)
• non-3DS LRDIMM Raw Cards: D/E (4RX4)
• 3DS LRDIMM Raw Cards: A/B (8RX4)
DIMM Mixing Guidelines
General Population Requirements
DIMM Mixing Rules
• All DIMMs must be all DDR4 DIMMs.
• x4 and x8 DIMMs can be mixed in the same channel.
• Mixing of LRDIMMs and RDIMMs is not allowed in the same channel, across different channels, and across different
sockets.
• Mixing of non-3DS and 3DS LRDIMM is not allowed in the same channel, across different channels, and across different
sockets.
Mixing of DIMM Types within a Channel
DIMM Types RDIMM LRDIMM 3DS LRDIMM
RDIMM Allowed Not Allowed Not Allowed
LRDIMM Not Allowed Allowed Not Allowed
3DS LRDIMM Not Allowed Not Allowed Allowed

Supermicro X11DPL-i Specifications

General

USB 2.0 ports quantity	4
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	3
Supported DIMM module capacities	64GB, 128MB
Memory voltage	1.2 V
Supported memory types	DDR4-SDRAM
Maximum internal memory	128 GB
Supported memory clock speeds	2133, 2400, 2666 MHz
RAID levels	0, 1, 5, 10
Wi-Fi	No
Ethernet LAN	Yes
Ethernet interface type	Gigabit Ethernet
System bus rate	10.4 GT/s
Processor manufacturer	Intel
Processor thermal power (max)	140 W
PCI Express x16 (Gen 3.x) slots	2
BIOS type	UEFI AMI
Motherboard chipset	Intel® C621
Motherboard form factor	ATX
Harmonized System (HS) code	84733020

Weight and Dimensions

Depth	257.8 mm
Width	306.7 mm