AM3359, AM3358, AM3357, AM3356, AM3354, AM3352
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SPRS717H –OCTOBER 2011–REVISED MAY 2015
5.8 Thermal Resistance Characteristics for ZCE and ZCZ Packages
Failure to maintain a junction temperature within the range specified in Section 5.5 reduces operating lifetime,
reliability, and performance—and may cause irreversible damage to the system. Therefore, the product design
cycle should include thermal analysis to verify the maximum operating junction temperature of the device. It is
important this thermal analysis is performed using specific system use cases and conditions. TI provides an
application report to aid users in overcoming some of the existing challenges of producing a good thermal
design. For more information, see AM335x Thermal Considerations (SPRABT1).
Table 5-12 provides thermal characteristics for the packages used on this device.
NOTE
Table 5-12 provides simulation data and may not represent actual use-case values.
Table 5-12. Thermal Resistance Characteristics (PBGA Package) [ ZCE and ZCZ]
ZCE (°C/W)
(1)
ZCZ (°C/W)
(1)
AIR FLOW
(2) (2)
(m/s)
(3)
R
ΘJC
Junction-to-case 10.3 10.2 N/A
R
ΘJB
Junction-to-board 11.6 12.1 N/A
R
ΘJA
Junction-to-free air 24.7 24.2 0
20.5 20.1 1.0
19.7 19.3 2.0
19.2 18.8 3.0
φ
JT
Junction-to-package top 0.4 0.3 0.0
0.6 0.6 1.0
0.7 0.7 2.0
0.9 0.8 3.0
φ
JB
Junction-to-board 11.9 12.7 0.0
11.7 12.3 1.0
11.7 12.3 2.0
11.6 12.2 3.0
(1) These values are based on a JEDEC-defined 2S2P system (with the exception of the theta JC [R
ΘJC
] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.
(2) °C/W = degrees Celsius per watt.
(3) m/s = meters per second.
Copyright © 2011–2015, Texas Instruments Incorporated Specifications 93
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