Xilinx Zynq UltraScale+ ZCU208 User Manual

• 2 ADC inputs – compression mount SMAs through high frequency baluns – Anaren
BD3150N50100AHF
• 2 ADC inputs - compression mount SMAs through high freq baluns – Anaren
BD4859N50100AHF
• 2 DAC outputs compression mount SMAs through low frequency baluns – Minicircuits
TCM2-33WX+
• 2 DAC outputs compression mount SMAs through mid frequency baluns – Anaren
BD1631J50100AHF
• 2 DAC outputs compression mount SMAs through high frequency baluns – Anaren
BD3150N50100AHF
• 2 DAC outputs - compression mount SMAs through high freq baluns – Anaren
BD4859N50100AHF
• 20 DACIO digital I/O pins on a header strip
• 20 ADCIO digital I/O pins on a header strip
• 12V, 5V0, 3V3, VCCADJ DAC, VCCADJ_ADC, DAV_AVTT, and GND, I2C signals access on a
header strip
The XM650 balun add-on card demonstraons DAC to ADC loopback with a 16T16R
conguraon of N79 baluns and lters. There is no external connecvity to the ADC or DAC
signals. Digital I/O and I2C are supported on headers.
The XM650 module features are:
• 16 DAC outputs looped back to 16 ADC inputs
• 32 N79 baluns and lters on the card
○ B46 or N79 band baluns can be supported with BOM change or rework by customers.
• 20 DACIO digital I/O pins on a header strip
• 20 ADCIO digital I/O pins on a header strip
• 12V, 5V0, 3V3, VCCADJ DAC, VCCADJ_ADC, DAV_AVTT, and GND access on a header strip
Board Specifications
Board Dimensions/Form Factor
When the module is mated with ZCU208 RFMC 2.0 connectors (Samtec LPAF-50-03.0-L-08-2-
K-TR), the mated height between the boards will be 4.0 mm. No component is placed on the
boom side of the module.
Appendix C: HW-XM650/655 Balun Daughter Cards for Gen 3 RFSoC EVM
UG1410 (v1.0) July 8, 2020 www.xilinx.com
ZCU208 Board User Guide 76
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Xilinx Zynq UltraScale+ ZCU208 Specifications

General

Brand	Xilinx
Model	Zynq UltraScale+ ZCU208
Category	Motherboard
Language	English