AMLOGIC S905D3 - 5.5.1 Normal GPIO Specifications (For DIO_xmA)

0.6 (2019–07–25)
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Jedec 2P2S board 101.5mm*114.5mm,natural convection, ambient temperature 25°C.
Symbol Parameter Value(°C/
Watt)
Air Flow(m/s)
Θja Package junction-to- ambiance thermal resistance in nature
convection
16.92 0
Θjb Package junction-to-pcb thermal resistance in nature
convection
8.13 0
Θjc Package junction-to-case thermal resistance in nature
convection
7.25 0
Note
1. Due to the thinness of the SOC, DRAM or capacitors placed close to SOC may prevent
heatsink touching SOC top side. A special convex shape heatsink is recommended.
2. These measurement were conducted on a JEDEC defined 2S2P system. For more
information, check below JEDEC standards:
●● JESD51-2A： Integrated Circuits Thermal Test Method Environmental Conditions - Natural
Convection (Still Air)
●● JESD51-8：Integrated Circuit Thermal Test Method Environmental Conditions —Junction-
to-Board
●● JESD51-12：Guidelines for Reporting and Using Electronic Package Thermal Information
3. m/s = meters per second
5.5 DC Electrical Characteristics
5.5.1 Normal GPIO Specifications (For DIO_xmA)
Symbol Parameter Min. Typ. Max. Unit
V
iH(VDDIO=3.3V)
3
High-level input
voltage
IOVREF+0.37 - VDDIO+0.3 V
V
iL(VDDIO=3.3V)
3
Low-level input
voltage
-0.3 - IOVREF-0.23 V
V
iH(VDDIO=1.8V)
3
High-level input
voltage
IOVREF/2+0.3 - VDDIO+0.3 V
V
iL(VDDIO=1.8V)
3
Low-level input
voltage
-0.3 - IOVREF/2-0.3 V
R
PU
Built-in pull up
resistor
50K 60K 70K ohm
R
PD
Built-in pull down
resistor
50K
5
60K 130K
6
ohm
IoL/IoH(DS=0)
1,4
GPIO driving
capability
0.5 - - mA
IoL/IoH(DS=1)
1
GPIO driving
capability
2.5 - - mA
IoL/IoH(DS=2)
1
GPIO driving
capability
3 - - mA
S905D3 Quick Reference Manual 5 Operating Conditions
Preliminary Version
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