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| Processor | NXP i.MX 8M Mini |
|---|---|
| CPU Speed | Up to 1.8 GHz |
| GPU | GC7000Lite |
| RAM | Up to 4 GB LPDDR4 |
| Connectivity | Wi-Fi, Bluetooth |
| Ethernet | Gigabit Ethernet |
| USB | USB 2.0, USB 3.0 |
| Operating System | Linux, Android |
| Operating Temperature | -40°C to +85°C |
| Form Factor | SMARC 2.0 |
| CPU Architecture | ARM Cortex-A53 |
| Storage | eMMC, SD card |
| Display Interface | HDMI, MIPI DSI |
| Camera Interface | MIPI CSI |
Overview of the module's main hardware and interface specifications.
Visual representation of the module's internal architecture and component connections.
Details on the module's power input requirements, voltage ranges, and specifications.
Physical size, mounting hole locations, and overall module dimensions.
Defines key terms like Tpcb, Tpcb_max, and Tpcb_min for thermal analysis.
Description of the I2S audio interface links for connecting codecs.
Details on the 10/100/1000 Mbps Ethernet controller and its interface signals.
Specifications for the USB 2.0 controller, including host/device and OTG capabilities.
Information on LVDS channels for display output, including single and dual-link options.
Details on the four UART interfaces and their supported modes and features.
Information on the I2C bus standard, features, and device addresses.
Configuration of boot devices and sequence using strap pins.
Information on available i.MX8M Mini CPU types and ordering details.
Describes the module's behavior during power on and shutdown sequences.
Details on SDRAM and eMMC memory options available on the module.
Overview of debugging interfaces including UART and JTAG connectors.
Overview of I2C devices on the module and their 7-bit addresses.
Overview of SPI devices, chip selects, and their mapping.
Introduction to the Yocto-based MSC-LDK and NXP release details.
Detailed guide on using the MSC-LDK for building Linux images.
Procedures for booting the operating system from different media.
Guide on updating the MSC-LDK with hotfixes and new releases.
Lists known hardware issues and limitations of the module.
Contact information for technical support and further assistance.