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Overview of the C100QM/C10QM module, its capabilities, supported network standards, and applications.
Details the module's band support, physical characteristics, application processor, operating voltage, and energy saving current.
Describes the internal circuit units of the module and provides a functional block diagram for understanding.
Outlines the chapter's focus on interface definitions, applications, and the sections covered.
Lists all the different interfaces provided by the C100QM/C10QM module for connectivity.
Details the physical pinout and layout of the 144-pin LCC interface for module connection.
Provides a comprehensive pin definition table for all module interfaces.
Explains the module's power supply pins, input requirements, and recommended power supply design.
Covers the module's boot process, power down control, and reset functionality.
Details the USB 2.0 High-Speed interface, its pin definitions, and supported features.
Covers the UART interfaces, including main serial, debug serial, RI, and DTR interfaces.
Explains the main serial port's capabilities, baud rates, and connection methods for AT commands and data.
Describes the debug serial port for Linux control, log printing, and module debugging.
Details the RI and DTR pins for host wake-up and sleep mode control functionalities.
Describes the USIM card interface, its standard compatibility, and power supply options.
Provides a reference circuit diagram for USIM card connection and necessary ESD protection.
Explains the USIM card hot-swap detection feature and its configuration via AT commands.
Lists and describes the general-purpose GPIO pins used for control signals and module functions.
Details the NET_STATUS pin for indicating RF communication status via an LED.
Describes the STATUS pin used to indicate the module's power-on status.
Explains the PCM audio interfaces, supported encoding formats, and clock signals.
Describes the I2C interface, its protocol, clock rate, and provides a reference circuit.
Details the 4-bit SD/MMC interface, voltage support, clock frequency, and card support.
Covers the SPI interface, clock rate, voltage domain, and its multiplexed usage as I2S.
Describes the MCLK interface and its clock output specifications.
Explains the analog-to-digital converter interfaces for reading voltage values.
Discusses the RF interfaces, including main, diversity, and GNSS antenna connections.
Lists the sections covered in the overall technical indicators chapter.
Details the GNSS reception parameters including center frequency, accuracy, and sensitivity.
Lists the operating frequency bands for LTE, GSM, UMTS, and CDMA technologies.
Specifies the test instruments, environment, and standards used for RF measurements.
Presents the receiving sensitivity and transmit power indicators for 2G, 3G, and 4G technologies.
Outlines the design requirements for the main set and GNSS antennas for optimal performance.
Details module power consumption in various operating modes and conditions.
Lists the topics covered in the interface electrical characteristics chapter.
Specifies the module's normal, extreme, and storage temperature ranges.
Details the module's IO voltage levels for input and output signals.
Outlines the module's input power requirements and operating voltage specifications.
Provides EMC design recommendations and ESD protection requirements for module integrity.
Presents the results of various reliability tests performed on the module.
Lists the sections related to structural and mechanical properties of the module.
Describes the module's physical appearance and construction.
Provides mechanical dimensions and drawings for the module.
Lists the topics related to module packaging and production processes.
Details the module's packaging, shipping, and storage conditions.
Provides recommendations for SMT production, stencil thickness, and reflow soldering process.
Lists the sections included in the appendix.
Provides a list of abbreviations used in the document with their full names.
Details GPRS/EDGE time slot allocation, coding schemes, and data rates.
Offers important safety information and precautions for using the wireless device.
Overview of the C100QM/C10QM module, its capabilities, supported network standards, and applications.
Details the module's band support, physical characteristics, application processor, operating voltage, and energy saving current.
Describes the internal circuit units of the module and provides a functional block diagram for understanding.
Outlines the chapter's focus on interface definitions, applications, and the sections covered.
Lists all the different interfaces provided by the C100QM/C10QM module for connectivity.
Details the physical pinout and layout of the 144-pin LCC interface for module connection.
Provides a comprehensive pin definition table for all module interfaces.
Explains the module's power supply pins, input requirements, and recommended power supply design.
Covers the module's boot process, power down control, and reset functionality.
Details the USB 2.0 High-Speed interface, its pin definitions, and supported features.
Covers the UART interfaces, including main serial, debug serial, RI, and DTR interfaces.
Explains the main serial port's capabilities, baud rates, and connection methods for AT commands and data.
Describes the debug serial port for Linux control, log printing, and module debugging.
Details the RI and DTR pins for host wake-up and sleep mode control functionalities.
Describes the USIM card interface, its standard compatibility, and power supply options.
Provides a reference circuit diagram for USIM card connection and necessary ESD protection.
Explains the USIM card hot-swap detection feature and its configuration via AT commands.
Lists and describes the general-purpose GPIO pins used for control signals and module functions.
Details the NET_STATUS pin for indicating RF communication status via an LED.
Describes the STATUS pin used to indicate the module's power-on status.
Explains the PCM audio interfaces, supported encoding formats, and clock signals.
Describes the I2C interface, its protocol, clock rate, and provides a reference circuit.
Details the 4-bit SD/MMC interface, voltage support, clock frequency, and card support.
Covers the SPI interface, clock rate, voltage domain, and its multiplexed usage as I2S.
Describes the MCLK interface and its clock output specifications.
Explains the analog-to-digital converter interfaces for reading voltage values.
Discusses the RF interfaces, including main, diversity, and GNSS antenna connections.
Lists the sections covered in the overall technical indicators chapter.
Details the GNSS reception parameters including center frequency, accuracy, and sensitivity.
Lists the operating frequency bands for LTE, GSM, UMTS, and CDMA technologies.
Specifies the test instruments, environment, and standards used for RF measurements.
Presents the receiving sensitivity and transmit power indicators for 2G, 3G, and 4G technologies.
Outlines the design requirements for the main set and GNSS antennas for optimal performance.
Details module power consumption in various operating modes and conditions.
Lists the topics covered in the interface electrical characteristics chapter.
Specifies the module's normal, extreme, and storage temperature ranges.
Details the module's IO voltage levels for input and output signals.
Outlines the module's input power requirements and operating voltage specifications.
Provides EMC design recommendations and ESD protection requirements for module integrity.
Presents the results of various reliability tests performed on the module.
Lists the sections related to structural and mechanical properties of the module.
Describes the module's physical appearance and construction.
Provides mechanical dimensions and drawings for the module.
Lists the topics related to module packaging and production processes.
Details the module's packaging, shipping, and storage conditions.
Provides recommendations for SMT production, stencil thickness, and reflow soldering process.
Lists the sections included in the appendix.
Provides a list of abbreviations used in the document with their full names.
Details GPRS/EDGE time slot allocation, coding schemes, and data rates.
Offers important safety information and precautions for using the wireless device.
General| Dimensions | 14.3 x 13.1 x 2.5 mm |
|---|---|
| Interface | UART, USB, GPIO, I2C, SPI |
| Operating Temperature | -40°C to +85°C |
| Cellular Technology | LTE Cat M1/NB1 |
| Interfaces | UART |
| Certifications | CE, FCC, PTCRB, GCF |
