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Elster Q.Sonic PLUS - Sealing; Main Plate; Spu

Elster Q.Sonic PLUS
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System Description
5
Page 26 of 68
Operation and Maintenance
UFM Series 6
Q.Sonic-plus
5.7 Sealing
This chapter describes the important sealing locations and sealing process
as required by MID certificate T10335 ( see also Chapter 12 MID
Requirements [p.63]). Even if MID is not required it is advised to seal the
UFM.
5.7.1 Main Plate
Figure 5-10 displays how the main plate is sealed to the flow cell:
Figure 5-10: Seal on the main plate to the flow cell
5.7.2 SPU
The SPU in the main compartment of the flameproof certified box is sealed
in 2 locations.
By means of the PCB sealing bracket the SPU electronics is sealed
to the flameproof certified box. Please see Figure 5-11 below.

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