Fluke 93 - Page 5

CONTENTS
V
5.
CALIBRATION
ADJUSTMENT
PROCEDURE 5-1
5.1 GENERAL INFORMATION
5-1
5.2 RECOMMENDED
CALIBRATION ADJUSTMENT
EQUIPMENT 5-1
5.3 ENTERING
THE CALIBRATION PROCEDURE
5-2
5.4 OPERATING THE
CAUBRATION PROCEDURE
5-3
5.5
CONTRAST CALIBRATION
ADJUSTMENT PROCEDURE 5-4
5.6
SCOPE CALIBRATION ADJUSTMENT
PROCEDURE 5-4
5.6.1 HARDWARE
SCOPE CAUBRATION
ADJUSTMENTS
5-4
5.6.2 CLOSED
CASE SCOPE CALIBRATION
ADJUSTMENTS 5-8
5.7 METER CAUBRATION
ADJUSTMENT
PROCEDURE
5-15
5.8
CALIBRATION ADJUSTMENT
PROCEDURE
SUMMARY 5-24
6.
DISASSEMBLING THE
SCOPEMETER
6-1
6.1
GENERAL INFORMATION
6-1
6.2. DISASSEMBLY
PROCEDURE
6-1
6.2.1 REMOVING
THE BATTERY
PACK
6-2
6.2.2 OPENING
THE SCOPEMETER
6-2
6.2.3
REMOVING
THE ANALOG A2 PCB. TO ENABLE
HARDWARE
SCOPE CAUBRATION
ADJUSTMENTS 6-4
6.2.4
REMOVING THE
DIGITAL A1 PCB 6-4
7.
CORRECTIVE MAINTENANCE
7-1
7,1 DIAGNOSTIC
TESTING AND TROUBLESHOOTING
7-1
7.1.1 INTRODUCTION
7-1
7.1.2 TROUBLESHOOTING
TECHNIQUES
7-1
7.1.3 DISPLAY AND
ERROR MESSAGES
7-2
7.1.4 MAIN TESTS
7-5
7.1.5 TROUBLESHOOTING
7-7
7.1.6 DIGITAL
At PCB TROUBLESHOOTING
7-7
7.1.7 ANALOG
A2 PCB TROUBLESHOOTING
7-28
72 REPLACEMB^TS
7-40
7.2.1 STANDARD
PARTS
7-40
7.2.2 SPECIAL PARTS
7-40
7.2.3 TRANSISTORS
AND INTEGRATED CIRCUITS
7-40
7.2.4
STATIC-SENSITIVE
COMPONENTS
7-40
7.2.5
REPLACEMENT
OF PARTS
7-42
7.3
SOLDERING TECHNIQUES
7.5I
7-3-1 GENERAL
SOLDERING TECHNIQUES
7-51
7.3.2 SOLDERING
MICRO-MINIATURE
SEMICONDUCTORS 7-51