HP Stream 11 User Manual

● Avoid contact with pins, leads, or circuitry.
● Place reusable electrostatic-sensitive parts from assemblies in protective packaging or conductive
foam.
Personal grounding methods and equipment
Use the following equipment to prevent static electricity damage to electronic components:
● Wrist straps are exible straps with a maximum of 1 MΩ ± 10% resistance in the ground cords. To
provide proper ground, a strap must be worn snug against bare skin. The ground cord must be
connected and t snugly into the banana plug connector on the grounding mat or workstation.
● Heel straps/Toe straps/Boot straps can be used at standing workstations and are compatible with
most types of shoes or boots. On conductive oors or dissipative oor mats, use them on both feet with
a maximum of 1 MΩ ± 10% resistance between the operator and ground.
Table 4-2 Static shielding protection levels
Static shielding protection levels
Method Voltage
Antistatic plastic
Carbon-loaded plastic
Metallized laminate
1,500
7,500
15,000
Grounding the work area
To prevent static damage at the work area, take the following precautions:
● Cover the work surface with approved static-dissipative material. Provide a wrist strap connected to the
work surface and properly grounded tools and equipment.
● Use static-dissipative mats, foot straps, or air ionizers to give added protection.
● Handle electrostatic sensitive components, parts, and assemblies by the case or PCB laminate. Handle
them only at static-free work areas.
● Turn o power and input signals before inserting and removing connectors or test equipment.
● Use xtures made of static-safe materials when xtures must directly contact dissipative surfaces.
● Keep work area free of nonconductive materials such as ordinary plastic assembly aids and Styrofoam.
● Use eld service tools, such as cutters, screwdrivers, and vacuums, that are conductive.
Recommended materials and equipment
HP recommends the following materials and equipment to prevent static electricity:
● Antistatic tape
● Antistatic smocks, aprons, or sleeve protectors
● Conductive bins and other assembly or soldering aids
● Conductive foam
● Conductive tabletop workstations with ground cord of 1 MΩ ± 10% resistance
● Static-dissipative table or oor mats with hard tie to ground
20 Chapter 4 Removal and replacement procedures preliminary requirements

HP Stream 11 Specifications

General

Form factor	Clamshell
Product type	Laptop
Product color	Blue
Country of origin	China
Internal memory	4 GB
Memory clock speed	1600 MHz
Memory form factor	On-board
Internal memory type	DDR3L-SDRAM
Memory layout (slots x size)	1 x 4 GB
Storage media	Flash
Optical drive type	No
Card reader integrated	Yes
Total storage capacity	32 GB
Compatible memory cards	SD
Display surface	Matt
Display diagonal	11.6 \
Display resolution	1366 x 768 pixels
Native aspect ratio	16:9
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics
On-board graphics card base frequency	311 MHz
On-board graphics card dynamic frequency (max)	792 MHz
Number of built-in speakers	2
Wi-Fi standards	802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version	4.0
Charging port type	DC-in jack
USB 2.0 ports quantity	1
VGA (D-Sub) ports quantity	0
Battery capacity	37 Wh
Number of battery cells	3
Pointing device	Touchpad
Operating shock	40 G
Operating altitude	0 - 3050 m
Non-operating shock	240 G
Operating vibration	1.043 G
Non-operating altitude	0 - 4570 m
Non-operating vibration	3.5 G
Storage temperature (T-T)	-15 - 60 °C
Operating temperature (T-T)	5 - 35 °C
Storage relative humidity (H-H)	10 - 90 %
Operating relative humidity (H-H)	10 - 80 %
Sustainability certificates	EPEAT Silver, ENERGY STAR
Cable lock slot type	Kensington
AC adapter power	45 W
AC adapter frequency	50 - 60 Hz
AC adapter input voltage	100 - 240 V
Stepping	C0
Tjunction	100 °C
Processor cache	1 MB
Processor model	N2840
System bus rate	- GT/s
Processor family	Intel® Celeron®
Processor series	Intel Celeron Processor N2000 Series for Mobile
Processor socket	BGA 1170
Processor codename	Bay Trail
Processor frequency	2.16 GHz
Processor cache type	L2
Processor lithography	22 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor boost frequency	2.58 GHz
Processor operating modes	32-bit, 64-bit
PCI Express configurations	1x4
Thermal Design Power (TDP)	7.5 W
Scenario Design Power (SDP)	4.5 W
Maximum number of PCI Express lanes	4
Operating system installed	Windows 8.1
Operating system architecture	64-bit
Processor code	SR1YJ
Processor ARK ID	82103
Processor package size	25 x 27 mm
Intel Secure Key Technology version	1.00

Weight and Dimensions

Depth	205.7 mm
Width	300 mm
Height	19.7 mm
Weight	1270 g