HP Stream 11 User Manual

Heat sink/thermal plate
Table 5-10 Heat sink/thermal plate description and part number
Description Spare part number
Heat sink/thermal plate for use in models with a Pentium or Celeron processor (includes replacement
thermal material)
L44446-001
Heat sink/thermal plate for use in models with an Atom processor (includes replacement thermal
material)
L61326-001
Before removing the heat sink, follow these steps:
1. Prepare the computer for disassembly (Preparation for disassembly on page 22).
2. Remove the keyboard/top cover (see Keyboard/top cover on page 22).
3. Disconnect the battery (see Battery on page 30).
Remove the heat sink:
1. Remove the two Phillips M2.0 × 2.5 screws (1) that secure the heat sink to the system board.
2. Remove the heat sink (2).
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board components each time the heat sink is removed. Thermal paste is used on the heat sink (1) and the
processor component on the system board (2).
Component replacement procedures 35

HP Stream 11 Specifications

General

Form factor	Clamshell
Product type	Laptop
Product color	Blue
Country of origin	China
Internal memory	4 GB
Memory clock speed	1600 MHz
Memory form factor	On-board
Internal memory type	DDR3L-SDRAM
Memory layout (slots x size)	1 x 4 GB
Storage media	Flash
Optical drive type	No
Card reader integrated	Yes
Total storage capacity	32 GB
Compatible memory cards	SD
Display surface	Matt
Display diagonal	11.6 \
Display resolution	1366 x 768 pixels
Native aspect ratio	16:9
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics
On-board graphics card base frequency	311 MHz
On-board graphics card dynamic frequency (max)	792 MHz
Number of built-in speakers	2
Wi-Fi standards	802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version	4.0
Charging port type	DC-in jack
USB 2.0 ports quantity	1
VGA (D-Sub) ports quantity	0
Battery capacity	37 Wh
Number of battery cells	3
Pointing device	Touchpad
Operating shock	40 G
Operating altitude	0 - 3050 m
Non-operating shock	240 G
Operating vibration	1.043 G
Non-operating altitude	0 - 4570 m
Non-operating vibration	3.5 G
Storage temperature (T-T)	-15 - 60 °C
Operating temperature (T-T)	5 - 35 °C
Storage relative humidity (H-H)	10 - 90 %
Operating relative humidity (H-H)	10 - 80 %
Sustainability certificates	EPEAT Silver, ENERGY STAR
Cable lock slot type	Kensington
AC adapter power	45 W
AC adapter frequency	50 - 60 Hz
AC adapter input voltage	100 - 240 V
Stepping	C0
Tjunction	100 °C
Processor cache	1 MB
Processor model	N2840
System bus rate	- GT/s
Processor family	Intel® Celeron®
Processor series	Intel Celeron Processor N2000 Series for Mobile
Processor socket	BGA 1170
Processor codename	Bay Trail
Processor frequency	2.16 GHz
Processor cache type	L2
Processor lithography	22 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor boost frequency	2.58 GHz
Processor operating modes	32-bit, 64-bit
PCI Express configurations	1x4
Thermal Design Power (TDP)	7.5 W
Scenario Design Power (SDP)	4.5 W
Maximum number of PCI Express lanes	4
Operating system installed	Windows 8.1
Operating system architecture	64-bit
Processor code	SR1YJ
Processor ARK ID	82103
Processor package size	25 x 27 mm
Intel Secure Key Technology version	1.00

Weight and Dimensions

Depth	205.7 mm
Width	300 mm
Height	19.7 mm
Weight	1270 g