Position FRU name
Possible failing
component
Type, CCIN, or part
number (use the
Type, model, and
part number list to
determine the part
number when the
type or CCIN are
given.)
Remove and replace/recovery
procedure
MB1 System unit
backplane
v Card
enclosure or
backplane
v Clock card
v SPCN card
v HSL I/O
bridge
v Processor
regulator
v Memory riser
card
v System unit
backplane
v HSL ring
connection
v HSL controller
v Processor
v Service
processor
v IOP
v Multi-adapter
bridge (all)
2249 (See page 521)
Note: Embedded IOP
(type 284D) is
exchanged with the
system unit backplane.
OR
224A (See page 521)
Note: Embedded IOP
(type 286F) is
exchanged with the
system unit backplane.
Go to Models 270, 800, and 810 -
System unit backplane - MB1.
D01 to D06 Disk unit Disk unit See the Type, model,
and part number list.
Go to Recovery procedures.
D07 Optical device Optical device See the Type, model,
and part number list.
Go to Models 270, 800, and 810 -
Removable media - D07 and D08.
D08 Tape unit Tape unit See the Type, model,
and part number list.
Go to Models 270, 800, and 810 -
Removable media - D07 and D08.
P01 Power supply Power supply See Final assembly —
Models 270, 800, and
810.
Go to Models 270, 800, and 810 - Power
supply - P01
B01, B02 AMD Air moving
device (AMD)
See Final assembly —
Models 270, 800, and
810.
Go to Models 270, 800, and 810 - Air
moving device - B01 and B02.
NB1 Control panel Control panel 247D (See page 523) Go to Models 270, 800, and 810 -
Control panel - NB1.
R01 Processor power
regulator
Processor power
regulator
04N4276 Go to Models 270, 800, and 810 -
Processor regulator - R01
DB1, DB2,
DB3
Device board Device board See the Type, model,
and part number list.
Go to Models 270, 800, and 810 -
Device board - DB1, DB2, and DB3
230 Hardware (Remove and Replace; Part Locations and Listings)
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