Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor—
Introduction
Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor
TDG October 2007
10 Order Number: 315279 - 003US
§ §
Ψ
SA
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (T
S
- T
A
) / Total Package Power.
Note: Heat source must be specified for Ψ measurements.
TIM
Thermal Interface Material: The thermally conductive compound between the heatsink and
the processor case. This material fills the air gaps and voids, and enhances the transfer of
the heat from the processor case to the heatsink.
P
MAX
The maximum power dissipated by a semiconductor component.
TDP
Thermal Design Power: a power dissipation target based on worst-case applications.
Thermal solutions should be designed to dissipate the thermal design power.
IHS
Integrated Heat Spreader: a thermally conductive lid integrated into a processor package
to improve heat transfer to a thermal solution through heat spreading.
LGA775 Socket
The surface mount socket designed to accept the processors in the 775-Land LGA
package.
ACPI Advanced Configuration and Power Interface.
Bypass
Bypass is the area between a passive heatsink and any object that can act to form a duct.
For this example, it can be expressed as a dimension away from the outside dimension of
the fins to the nearest surface.
Thermal Monitor
A feature on the processor that attempts to keep the processor die temperature within
factory specifications.
TCC
Thermal Control Circuit: Thermal Monitor uses the TCC to reduce die temperature by
lowering effective processor frequency when the die temperature has exceeded its
operating limits.
T
DIODE
Temperature reported from the on-die thermal diode.
FSC
Fan Speed Control: Thermal solution that includes a variable fan speed which is driven by
a PWM signal and uses the on-die thermal diode as a reference to change the duty cycle of
the PWM signal.
T
CONTROL
T
CONTROL
is the specification limit for use with the on-die thermal diode.
PWM
Pulse width modulation is a method of controlling a variable speed fan. The enabled 4 wire
fans use the PWM duty cycle percent from the fan speed controller to modulate the fan
speed.
Health Monitor
Component
Any standalone or integrated component that is capable of reading the processor
temperature and providing the PWM signal to the 4 pin fan header.
TMA
Thermal Module Assembly. The heatsink, fan and duct assembly for the BTX thermal
solution.
Table 2. Terms Used (Sheet 2 of 2)
Term Description
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