Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor—Thermal
Metrology
Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor
TDG October 2007
24 Order Number: 315279 - 003US
half way between the fan hub and the fan housing. If a variable speed fan is used, it
may be useful to add a thermocouple taped to the barrier above the location of the
temperature sensor used by the fan to check its speed setting against air temperature.
When measuring TA in a chassis with a live motherboard, add-in cards, and other
system components, it is likely that the TA measurements will reveal a highly non-
uniform temperature distribution across the inlet fan section.
For passive heatsinks, thermocouples should be placed approximately 13 mm to 25
mm [0.5 to 1.0 in] away from processor and heatsink as shown in Figure 5. The
thermocouples should be placed approximately 51 mm [2.0 in] above the baseboard.
This placement guideline is meant to minimize the effect of localized hot spots from
baseboard components.
Note: Testing an active heatsink with a variable speed fan can be done in a thermal chamber
to capture the worst-case thermal environment scenarios. Otherwise, when doing a
bench top test at room temperature, the fan regulation prevents the heatsink from
operating at its maximum capability. To characterize the heatsink capability in the
worst-case environment in these conditions, it is then necessary to disable the fan
regulation and power the fan directly, based on guidance from the fan supplier.
Note: Drawing Not to Scale
Figure 5. Locations for Measuring Local Ambient Temperature, Active Heatsink
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