Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray User Manual

Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor
October 2007 TDG
Order Number: 315279 - 003US 33
Intel® Reference Thermal Solution—Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor
5.0 Intel® Reference Thermal Solution
5.1 Thermal Solution Requirements
The thermal performance required for the heatsink is determined by calculating the
case-to-ambient thermal characterization parameter, Ψ
CA
, as explained in Section 3.1.
This is a basic thermal engineering parameter that may be used to evaluate and
compare different thermal solutions in similar boundary conditions. An example of how
Ψ
CA
is calculated for the Intel® Core™ 2 Duo E6400, E4300, and Intel® Pentium®
Dual-Core E2160 Processors for Embedded Applications is shown in Equation 3.
Equation 3. Case-to-Ambient Thermal Characterization Parameter
In this calculation, T
C-MAX
and TDP are taken from the thermal profile specification in
the Intel
®
Core™2 Extreme Processor X6800 and Intel
®
Core™2 Duo Desktop
Processor E6000 Sequence Datasheet. It is important to note that in this calculation,
the T
C-MAX
and TDP are constant, while Ψ
CA
will vary according to the local ambient
temperature (TLA).
Table 1 shows an example of required thermal characterization parameters for the
thermal solution at various TLAs. This table uses the TC max and TDP from the
datasheets. These numbers are subject to change, and in case of conflict, the
specifications in the processor datasheet supersede the T
C-MAX
and TDP specifications
in this document.
Figure 10 further illustrates the required thermal characterization parameter for the
Intel® Core™ 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processors
for Embedded Applications at various operating ambient temperatures. The thermal
solution design must have a Ψ
CA
less than the values shown for the given local ambient
temperature.
W
C
W
CC
WTDP
CTCT
LAC
CA
ooooo
360.0
65
384.61
)(
)()(
max
=
−
=
−
=Ψ
Table 3. Thermal Characterization Parameter at various T
LA
's
Intel® Core™2 Duo E6400,
E4300, and Intel® Pentium®
Dual-Core E2160 Processors for
Embedded Applications in the
775-Land Package
Required Ψ
CA (°C/W) of Thermal Solution at TLA = (°C)
TDP (W) TC Max (°C) 44.1 40 35 30
65 61.4 0.266 0.329 0.406 0.483

Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray Specifications

General

Processor Model	Intel Pentium Dual-Core E2160
Clock Speed	1.80 GHz
FSB Speed	800 MHz
L2 Cache	1 MB
Socket	LGA 775
Core Count	2
Thermal Design Power (TDP)	65 W
Core	Conroe
Manufacturing Process	65 nm
Virtualization Technology	No
Hyper-Threading	No
Turbo Boost	No
Instruction Set	MMX, SSE, SSE2, SSE3
Memory Types	DDR2