Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor
October 2007 TDG
Order Number: 315279 - 003US 7
Introduction—Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160
Processor
1.0 Introduction
1.1 Document Goals and Scope
1.1.1 Importance of Thermal Management
The objective of thermal management is to ensure that the temperatures of all
components in a system are maintained within their functional temperature range.
Within this range, a component is expected to meet its specified performance level.
Operation outside the functional temperature range can degrade system performance,
cause logic errors or cause component and/or system damage. Temperatures
exceeding the maximum operating limit of a component may result in irreversible
changes in the operating characteristics of this component.
In a system environment, the processor temperature is a function of both system and
component thermal characteristics. The system level thermal constraints consist of the
local ambient air temperature and airflow over the processor as well as the physical
constraints at and above the processor. The processor temperature depends on the
component power dissipation, the processor package thermal characteristics and the
processor thermal solution.
All of these parameters are affected by the continued push of technology to increase
processor performance levels and packaging density (more transistors). As operating
frequencies increase and packaging size decreases, the power density increases while
the thermal solution space and airflow typically become more constrained or remains
the same within the system. The result is an increased importance on system design to
ensure that thermal design requirements are met for each component, including the
processor, in the system.
1.1.2 Document Goals
Depending on the type of system and the chassis characteristics, new system and
component designs may be required to provide adequate cooling for the processor. The
goal of this document is to provide an understanding of these thermal characteristics
and discuss guidelines for meeting the thermal requirements imposed on single
processor systems using the Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor.
The concepts given in this document are applicable to any system form factor. Specific
examples used will be the Intel enabled reference solution for PICMG 1.3 server
systems. Please refer to the applicable ATX and BTX form factor reference documents
and thermal design guidelines to design a thermal solution for those form factors.
1.1.3 Document Scope
In this document, when a reference is made to "the processor", it is intended that this
includes all the processors described and supported in this document. If needed for
clarity, the specific processor will be listed.
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