Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray User Manual

Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor
October 2007 TDG
Order Number: 315279 -003US 11
Processor Thermal/Mechanical Information—Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor
2.0 Processor Thermal/Mechanical Information
2.1 Mechanical Requirements
2.1.1 Processor Package
The processor is packaged in a 775-Land LGA package that interfaces with the
motherboard via a LGA775 socket. Refer to the datasheet for detailed mechanical
specifications.
The processor connects to the motherboard through a land grid array (LGA) surface
mount socket. The socket contains 775 contacts arrayed about a cavity in the center of
the socket with solder balls for surface mounting to the motherboard. The socket is
named LGA775 socket. A description of the socket can be found in the LGA775 Socket
Mechanical Design Guide.
The package includes an integrated heat spreader (IHS) that is shown in Figure 1.
Refer to the processor datasheet for more information. In case of conflict, the package
dimensions in the processor datasheet supersedes dimensions provided in this
document.
Figure 1. Package IHS Load Areas
Top Surface of IHS
to install a heatsink
IHS Step
to interface with LGA775
Socket Load Plate
Substrate
Top Surface of IHS
to install a heatsink
IHS Step
to interface with LGA775
Socket Load Plate
Substrate

Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray Specifications

General

Processor Model	Intel Pentium Dual-Core E2160
Clock Speed	1.80 GHz
FSB Speed	800 MHz
L2 Cache	1 MB
Socket	LGA 775
Core Count	2
Thermal Design Power (TDP)	65 W
Core	Conroe
Manufacturing Process	65 nm
Virtualization Technology	No
Hyper-Threading	No
Turbo Boost	No
Instruction Set	MMX, SSE, SSE2, SSE3
Memory Types	DDR2