Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor
October 2007 TDG
Order Number: 315279 - 003US 45
LGA775 Socket Heatsink Loading—Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor
This board deflection metric provides guidance for mechanical designs that differ from
the reference design for ATX//µATX form factor.
A.2.2 Motherboard Deflection Metric Definition
Motherboard deflection is measured along either diagonal (refer to Figure 18):
d = dmax - (d1 + d2)/2
d' = dmax - (d'1 + d'2)/2
Configurations in which the deflection is measured are defined in the Table 2 below.
To measure board deflection, follow industry standard procedures (such as IPC) for
board deflection measurement. Height gauges and possibly dial gauges may also be
used.
Table 4. Board Deflection Configuration Definitions
Configuration
Parameter
Processor +
Socket load plate
Heatsink Parameter Name
d_ref yes no BOL deflection, no preload
d_BOL yes yes BOL deflection with preload
d_EOL yes yes EOL deflection
Note:
BOL: Beginning of Life
EOL: End of Life
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