EasyManuals Logo

Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray User Manual

Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray
55 pages
To Next Page IconTo Next Page
To Next Page IconTo Next Page
To Previous Page IconTo Previous Page
To Previous Page IconTo Previous Page
Page #9 background imageLoading...
Page #9 background image
Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor
October 2007 TDG
Order Number: 315279 - 003US 9
Introduction—Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160
Processor
1.2 References
Material and concepts available in the documents listed in Table 1 may be beneficial
when reading this document.
1.3 Definition of Terms
Table 1. Referenced Documents
Document Comment
Intel® Core™2 Duo Desktop Processor, Intel® Pentium® Dual-Core
Processor, and Intel® Pentium® 4 Processor 6x1 Sequence
Thermal and Mechanical Design Guidelines
http://developer.intel.com/
design/processor/designex/
313685.htm
LGA775 Socket Mechanical Design Guide
http://developer.intel.com/
design/Pentium4/guides/
302666.htm
Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo
Desktop Processor E6000 Sequence Datasheet
http://www.intel.com/design/
processor/datashts/313278.htm
Intel® Pentium® Dual-Core Processor E2000 Sequence Datasheet
http://www.intel.com/design/
processor/datashts/316981.htm
Intel® Core™2 Processor and Intel® Pentium® Dual Core Processor
Thermal and Mechanical Design Guidelines
http://www.intel.com/design/
processor/designex/317804.htm
Intel® Pentium® 4 Processor on 90 nm Process in the 775-Land LGA
Package Thermal and Mechanical Design Guidelines
http://developer.intel.com/
design/Pentium4/guides/
302553.htm
Fan Specification for 4-wire PWM Controlled Fans http://www.formfactors.org/
Performance ATX Desktop System Thermal Design Suggestions http://www.formfactors.org/
Performance microATX Desktop System Thermal Design Suggestions http://www.formfactors.org/
Balanced Technology Extended (BTX) System Design Guide http://www.formfactors.org/
Table 2. Terms Used (Sheet 1 of 2)
Term Description
T
A
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan inlet for
an active heatsink. Also referred to as T
LA
.
T
C
The case temperature of the processor, measured at the geometric center of the topside of
the IHS.
T
E
The ambient air temperature external to a system chassis. This temperature is usually
measured at the chassis air inlets. Also referred to as T
EXT
.
T
S
Heatsink temperature measured on the underside of the heatsink base, at a location
corresponding to T
C
.
T
C-MAX
The maximum case temperature as specified in a component specification.
Ψ
CA
Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution
performance using total package power. Defined as (T
C
- T
A
) / Total Package Power.
Note: Heat source must be specified for Ψ measurements.
Ψ
CS
Case-to-sink thermal characterization parameter. A measure of thermal interface material
performance using total package power. Defined as (T
C
- T
S
) / Total Package Power. Also
referred to as Ψ
TIM
.
Note: Heat source must be specified for Ψ measurements.

Table of Contents

Questions and Answers:

Question and Answer IconNeed help?

Do you have a question about the Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray and is the answer not in the manual?

Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray Specifications

General IconGeneral
Processor ModelIntel Pentium Dual-Core E2160
Clock Speed1.80 GHz
FSB Speed800 MHz
L2 Cache1 MB
SocketLGA 775
Core Count2
Thermal Design Power (TDP)65 W
CoreConroe
Manufacturing Process65 nm
Virtualization TechnologyNo
Hyper-ThreadingNo
Turbo BoostNo
Instruction SetMMX, SSE, SSE2, SSE3
Memory TypesDDR2

Related product manuals