Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray

Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor
October 2007 TDG
Order Number: 315279 - 003US 9
Introduction—Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160
Processor
1.2 References
Material and concepts available in the documents listed in Table 1 may be beneficial
when reading this document.
1.3 Definition of Terms
Table 1. Referenced Documents
Document Comment
Intel® Core™2 Duo Desktop Processor, Intel® Pentium® Dual-Core
Processor, and Intel® Pentium® 4 Processor 6x1 Sequence
Thermal and Mechanical Design Guidelines
http://developer.intel.com/
design/processor/designex/
313685.htm
LGA775 Socket Mechanical Design Guide
http://developer.intel.com/
design/Pentium4/guides/
302666.htm
Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo
Desktop Processor E6000 Sequence Datasheet
http://www.intel.com/design/
processor/datashts/313278.htm
Intel® Pentium® Dual-Core Processor E2000 Sequence Datasheet
http://www.intel.com/design/
processor/datashts/316981.htm
Intel® Core™2 Processor and Intel® Pentium® Dual Core Processor
Thermal and Mechanical Design Guidelines
http://www.intel.com/design/
processor/designex/317804.htm
Intel® Pentium® 4 Processor on 90 nm Process in the 775-Land LGA
Package Thermal and Mechanical Design Guidelines
http://developer.intel.com/
design/Pentium4/guides/
302553.htm
Fan Specification for 4-wire PWM Controlled Fans http://www.formfactors.org/
Performance ATX Desktop System Thermal Design Suggestions http://www.formfactors.org/
Performance microATX Desktop System Thermal Design Suggestions http://www.formfactors.org/
Balanced Technology Extended (BTX) System Design Guide http://www.formfactors.org/
Table 2. Terms Used (Sheet 1 of 2)
Term Description
T
A
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan inlet for
an active heatsink. Also referred to as T
LA
.
T
C
The case temperature of the processor, measured at the geometric center of the topside of
the IHS.
T
E
The ambient air temperature external to a system chassis. This temperature is usually
measured at the chassis air inlets. Also referred to as T
EXT
.
T
S
Heatsink temperature measured on the underside of the heatsink base, at a location
corresponding to T
C
.
T
C-MAX
The maximum case temperature as specified in a component specification.
Ψ
CA
Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution
performance using total package power. Defined as (T
C
- T
A
) / Total Package Power.
Note: Heat source must be specified for Ψ measurements.
Ψ
CS
Case-to-sink thermal characterization parameter. A measure of thermal interface material
performance using total package power. Defined as (T
C
- T
S
) / Total Package Power. Also
referred to as Ψ
TIM
.
Note: Heat source must be specified for Ψ measurements.