Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray User Manual

Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor—Processor
Thermal/Mechanical Information
Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor
TDG October 2007
20 Order Number: 315279 -003US
• Surface area of the heatsink.
• Heatsink material and technology.
• Volume of airflow over the heatsink surface area.
• Development of airflow entering and within the heatsink area.
• Physical volumetric constraints placed by the system.
2.5 System Integration Considerations
Manufacturing with Intel® Components using 775-Land LGA Package and LGA775
Socket documentation provides Best Known Methods for all aspects of LGA775 socket
based platforms and systems manufacturing. Of particular interest for package and
heatsink installation and removal is the System Assembly module. A video covering
system integration is also available. Contact your Intel field sales representative for
more information.

Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray Specifications

General

Processor Model	Intel Pentium Dual-Core E2160
Clock Speed	1.80 GHz
FSB Speed	800 MHz
L2 Cache	1 MB
Socket	LGA 775
Core Count	2
Thermal Design Power (TDP)	65 W
Core	Conroe
Manufacturing Process	65 nm
Virtualization Technology	No
Hyper-Threading	No
Turbo Boost	No
Instruction Set	MMX, SSE, SSE2, SSE3
Memory Types	DDR2