Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray

Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor
October 2007 TDG
Order Number: 315279 - 003US 3
Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor
Contents
1.0 Introduction..............................................................................................................7
1.1 Document Goals and Scope ..................................................................................7
1.1.1 Importance of Thermal Management...........................................................7
1.1.2 Document Goals.......................................................................................7
1.1.3 Document Scope......................................................................................7
1.2 References .........................................................................................................9
1.3 Definition of Terms..............................................................................................9
2.0 Processor Thermal/Mechanical Information ............................................................11
2.1 Mechanical Requirements ...................................................................................11
2.1.1 Processor Package..................................................................................11
2.1.2 Heatsink Attach .....................................................................................12
2.2 Thermal Requirements.......................................................................................14
2.2.1 Processor Case Temperature....................................................................14
2.2.2 Thermal Profile ......................................................................................15
2.2.3 T
CONTROL
.................................................................................................16
2.3 Heatsink Design Considerations...........................................................................17
2.3.1 Heatsink Size.........................................................................................17
2.3.2 Heatsink Mass........................................................................................18
2.3.3 Package IHS Flatness..............................................................................18
2.3.4 Thermal Interface Material.......................................................................18
2.4 System Thermal Solution Considerations..............................................................19
2.4.1 Chassis Thermal Design Capabilities..........................................................19
2.4.2 Improving Chassis Thermal Performance...................................................19
2.4.3 Summary..............................................................................................19
2.5 System Integration Considerations ......................................................................20
3.0 Thermal Metrology ..................................................................................................21
3.1 Characterizing Cooling Performance Requirements.................................................21
3.1.1 Example................................................................................................22
3.2 Processor Thermal Solution Performance Assessment.............................................23
3.3 Local Ambient Temperature Measurement Guidelines.............................................23
3.4 Processor Case Temperature Measurement Guidelines............................................25
4.0 Thermal Management Logic and Thermal Monitor Feature.......................................26
4.1 Processor Power Dissipation................................................................................26
4.2 Thermal Monitor Implementation.........................................................................26
4.2.1 PROCHOT# Signal..................................................................................27
4.2.2 Thermal Control Circuit ...........................................................................27
4.2.3 Thermal Monitor 2..................................................................................28
4.2.4 Operation and Configuration ....................................................................29
4.2.5 On-Demand Mode ..................................................................................30
4.2.6 System Considerations............................................................................30
4.2.7 Operating System and Application Software Considerations..........................31
4.2.8 THERMTRIP# Signal ...............................................................................31
4.2.9 Cooling System Failure Warning ...............................................................31
4.2.10 Digital Thermal Sensor............................................................................31
4.2.11 Platform Environmental Control Interface (PECI) ........................................32
5.0 Intel® Reference Thermal Solution..........................................................................33
5.1 Thermal Solution Requirements...........................................................................33
5.2 PICMG 1.3 Form Factor......................................................................................34
5.3 ATX/BTX form factors ........................................................................................36