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Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray

Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray
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Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor—
Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor
TDG October 2007
4 Order Number: 315279 - 003US
5.4 Altitude ............................................................................................................36
5.5 Geometric Envelope for Intel Reference PICMG 1.3 Thermal Mechanical Design..........37
6.0 Intel® Quiet System Technology (Intel® QST).........................................................38
6.1 Intel
®
QST Algorithm.........................................................................................38
6.1.1 Output Weighting Matrix..........................................................................39
6.1.2 Proportional-Integral-Derivative (PID) .......................................................39
6.2 Board and System Implementation of Intel® QST..................................................41
6.3 Intel
®
QST Configuration and Tuning....................................................................43
6.4 Fan Hub Thermistor and Intel
®
QST.....................................................................43
A LGA775 Socket Heatsink Loading.............................................................................44
A.1 LGA775 Socket Heatsink Considerations ...............................................................44
A.2 Metric for Heatsink Preload for Designs Non-Compliant with Intel Reference Design....44
A.3 Heatsink Selection Guidelines..............................................................................49
B Thermal Interface Management ...............................................................................50
B.1 Bond Line Management ......................................................................................50
B.2 Interface Material Area.......................................................................................50
B.3 Interface Material Performance............................................................................50
C Case Temperature Reference Metrology...................................................................51
C.1 Objective and Scope ..........................................................................................51
D Mechanical Drawings ...............................................................................................53
E Intel® Enabled Reference Solution Information.......................................................56

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