Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray

Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor
October 2007 TDG
Order Number: 315279 - 003US 5
Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor
Figures
1 Package IHS Load Areas ...........................................................................................11
2 Processor Case Temperature Measurement Location .....................................................15
3 Example Thermal Profile ...........................................................................................16
4 Processor Thermal Characterization Parameter Relationships .........................................22
5 Locations for Measuring Local Ambient Temperature, Active Heatsink..............................24
6 Locations for Measuring Local Ambient Temperature, Passive Heatsink............................25
7 Concept for Clocks under Thermal Monitor Control........................................................28
8 Thermal Monitor 2 Frequency and Voltage Ordering......................................................29
9T
CONTROL
for Digital Thermal Sensor .............................................................................32
10 Thermal Characterization Parameters for Various Operating Conditions ...........................34
11 PICMG 1.3 Copper Heatsink.......................................................................................35
12 PICMG 1.3 Heatsink Performance...............................................................................36
13 Intel® QST Overview ...............................................................................................39
14 PID Controller Fundamentals .....................................................................................40
15 Intel® QST Platform Requirements.............................................................................41
16 Example Acoustic Fan Speed Control Implementation....................................................42
17 Digital Thermal Sensor and Thermistor ......................................................................43
18 Board Deflection Definition........................................................................................46
19 Example: Defining Heatsink Preload Meeting Board Deflection Limit................................48
20 PICMG 1.3 Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling
Components, Primary Side ........................................................................................54
21 PICMG 1.3 Motherboard Keep-out, Secondary Side.......................................................55
Tables
1 Referenced Documents...............................................................................................9
2 Terms Used...............................................................................................................9
3 Thermal Characterization Parameter at various T
LA
's.....................................................33
4 Board Deflection Configuration Definitions ...................................................................45
5 Intel Reference Component PICMG 1.3 Thermal Solution Providers .................................56