Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor—Intel®
Reference Thermal Solution
Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor
TDG October 2007
34 Order Number: 315279 - 003US
5.2 PICMG 1.3 Form Factor
Thermal solution design for the Intel® Core™ 2 Duo E6400, E4300, and Intel®
Pentium® Dual-Core E2160 Processors for Embedded Applications in the PICMG 1.3
form factor is very challenging. Due to limited volume for the heatsink (mainly in
direction of heatsink height) and the available amount of airflow, system designers may
have to make some tradeoffs in the system boundary condition requirements (i.e.,
maximum T
LA
, acoustic requirements, etc.) in order to meet the processor's thermal
requirements. The entire thermal solution from the heatsink design, chassis
configuration and airflow source needs to be optimized for server systems in order to
obtain the best performing solution.
Intel has worked with a third party vendor to enable a heatsink design for the Intel®
Core™ 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processors for
Embedded Applications for the PICMG 1.3 form factor. This design was optimized for
the PICMG 1.3 form factor within the available volume for the thermal solution. The
motherboard component keep-ins can be seen in Figure 20 and Figure 20.
This solution requires 100% of the airflow to be ducted through the heatsink fins in
order to prevent heatsink bypass. It is a copper base and copper fin heatsink that is
attached to the motherboard with the use of a backplate. This solution is shown in
Figure 11.
Figure 10. Thermal Characterization Parameters for Various Operating Conditions
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