Intel® Server Board S1200SP Family Technical Product Specification
95
processor and system. The server board is designed to support the Intel
®
Xeon
®
Processor E3-1200 V5 and V6
product family TDP guidelines up to and including 80W.
Disclaimer Note: Intel Corporation server boards contain a number of high-density VLSI and power delivery
components that need adequate airflow to cool. Intel
®
ensures through its own chassis development and
testing that when Intel
®
server building blocks are used together, the fully integrated system will meet the
intended thermal requirements of these components. It is the responsibility of the system integrator who
chooses not to use Intel developed server building blocks to consult vendor datasheets and operating
parameters to determine the amount of airflow required for their specific application and environmental
conditions. Intel Corporation cannot be held responsible, if components fail or the server board does not
operate correctly when used outside any of their published operating or non-operating limits.
11.2 MTBF
The following is the calculated Mean Time Between Failures (MTBF) 40 degree C (ambient air). These values
are derived using a historical failure rate and multiplied by factors for application, electrical and/or thermal
stress and for device maturity. You should view MTBF estimates as “reference numbers” only.
• Calculate standard: Telcordia* issue 2
• Calculate Method: Method I-D
• Temperature = 40 degree C
• Environment = GB, GC – Ground Benign, Controlled
• Model = Serial
• Duty cycle = 100%
• Component Quality: Level II
• Adhere to De-rating data
Table 53. MTBF Estimate
Intel® Server Board S1200SPL
Intel® Server Board S1200SPS
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