Intel Xeon Datasheet

Intel® Xeon™ Processor with 800 MHz System Bus
Datasheet 35
3.4 Package Handling Guidelines
Table 18 includes a list of guidelines on a package handling in terms of recommended maximum
loading on the processor IHS relative to a fixed substrate. These package handling loads may be
experienced during heatsink removal.
NOTES:
1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2. A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.
3. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top
surface.
4. These guidelines are based on limited testing for design characterization and incidental applications (one
time only).
5. Handling guidelines are for the package only and do not include the limits of the processor socket.
3.5 Package Insertion Specifications
The Intel® Xeon™ processor with 800 MHz system bus can be inserted and removed 15 times
from an mPGA604 socket, which meets the criteria outlined in the mPGA604 Socket Design
Guidelines.
3.6 Processor Mass Specifications
The typical mass of the Intel® Xeon™ processor with 800 MHz system bus is 25 grams [0.88 oz.].
This mass [weight] includes all components which make up the entire processor product.
3.7 Processor Materials
The Intel® Xeon™ processor with 800 MHz system bus is assembled from several components.
The basic material properties are described in Table 19.
Table 18. Package Handling Guidelines
Parameter Maximum Recommended Notes
Shear 356 N
80 lbf
1, 4, 5
Tensile 156 N
35 lbf
2, 4, 5
Torque 8 N-m
70 lbf-in
3, 4, 5
Table 19. Processor Materials
Component Material
Integrated Heat Spreader (IHS) Nickel over copper
Substrate Fiber-reinforced resin
Substrate Pins Gold over nickel

Intel Xeon Specifications

General

Brand	Intel
Model	Xeon
Category	Processor
Language	English