Intel Xeon Datasheet

Intel® Xeon™ Processor with 800 MHz System Bus
Datasheet 81
NOTES:
1. The heatsink in this image is for reference only, and may not represent any of the actual boxed processor
heatsinks.
2. The screws, springs, and standoffs will be captive to the heatsink. This image shows all of the components in
an exploded view.
3. It is intended that the CEK spring will ship with the baseboard and be pre-attached prior to shipping.
8.2 Mechanical Specifications
This section documents the mechanical specifications of the boxed processor.
8.2.1 Boxed Processor Heatsink Dimensions (CEK)
The boxed processor will be shipped with an unattached thermal solution. Clearance is required
around the thermal solution to ensure unimpeded airflow for proper cooling. The physical space
requirements and dimensions for the boxed processor and assembled heatsink are shown in Figure
20 through Figure 24. Figure 25 through Figure 26 are the mechanical drawings for the 4-pin server
board fan header and 4-pin connector used for the active CEK fan heatsink solution.
Figure 19. Passive Intel® Xeon™ Processor with 800 MHz System Bus Thermal Solution
(2U and larger)
Heat sink
Heat sink standoff
s
Heat sink screw
springs
Thermal Interface
Material
Heat sink
screws
Motherboard
and
processor
Chassis pan
Protective Tape
CEK spring
Heat sink
Heat sink standoff
s
Heat sink screw
springs
Thermal Interface
Material
Heat sink
screws
Motherboard
and
processor
Chassis pan
Protective Tape
CEK spring

Intel Xeon Specifications

General

Brand	Intel
Model	Xeon
Category	Processor
Language	English