5. MEMORY ICs, BATTERY, CABLES AND DIN ADAPTER
--------------------
MELSEC-A
5. MEMORY ICs, BATTERY, CABLES AND DIN ADAPTER
I
5.1
Memory
les
This section describes specifications, handling instructions and installation
of the memory ICs used in the A2C.
5.1.1 Specifications
Table 5.1 shows specifications of
the
ROMs to be installed to
the
program
memory sockets of the A2C.
Table
5.1
Memory
Specifications
~
4KROM
8KROM
16KROM
Item
Memory
EP-ROM
(only
read is
possible)
specifications
Memory
capacity
8K
16 K 32 K
(bytes) (Max. 2 K steps) (Max. 6 K steps) (Max. 8 K steps)
Structure 2B-pin IC
package
28-pin Ie
package
2B-pin IC
package
Remarks
Make
sure
the
correct
installing
direction
•
5.1.2 Handling Instructions
This chapter gives
the
handling instructions from unpacking to installation
and
also the nomenclature and setting of various conditions,
(1) When loading the memory into the socket, press
the
memory securely
against the socket and then lock it with
the
lever. After loading, make
sure
that
the memory is flush with the socket.
(2) Never place the memory on metal, which may allow current flow, or on
an
object
which is charged with static electricity, such as wood, plastic,
vinyl. fiber, cable, and paper.
(3) Do not
touch
the legs of the memory. Also, do not bend
the
legs.
(4) When mounting the memory, be sure to fit the memory the right way
round as indicated on the socket. If reversely installed,
the
memory will
be damaged.
5-1