UNIFLOW
®
2 PULSED THERMODE CONTROL
990-228 1-1
CHAPTER 1
DESCRIPTION
Section I: Features
Overview
For the rest of this manual, the Uniflow
®
2 Pulsed Thermode
Control will simply be referred to as
the Control. This manual describes the most common or “typical” components and options. If you
have questions about custom items in your Control that are not covered in this manual, contact Unitek
Miyachi using the phone, e-mail, or mailing information in the Foreword of this manual.
The Control is a power supply designed for
reflow soldering or heat sealing electronic
interconnections using a precisely controlled
temperature profile.
The design of the Control is directed toward
compactness, reliability, safety and simplicity,
and ease of repair.
The operator is coached by visual displays on a
Liquid Crystal Display (LCD) screen if out-of-
range entries are made, or when alarm/error
conditions occur.
Up to 15 heat profiles (the records containing
the joining parameters to be used during the
oining cycles) can be programmed, stored, and
recalled for use.
Reflow soldering is a multi-step metal joining process where:
x Two solder-coated parts are brought into intimate contact, using a preset force.
x The temperature of the two parts is raised to a preheat temperature for a preset time to activate the
pre-applied flux. The flux removes the surface oxides from the solder-plated parts.
x The temperature is then raised to the reflow temperature for a pre-set time to melt the solder
between the parts.
x Cooling is then initiated to allow the solder to solidify.
x Upon reaching the pre-set cool temperature, the reflow head can be retracted, removing force from
the parts.
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