Operation Manual Outline of Operation Procedure
2 Outline of Operation Procedures
1 Description of Symbols
The meanings of the symbols used in Chapter 2 and are explained below.
[ ]: Indicates the name which is shown on the operation panel
Names in parentheses are the names shown on the wafer loader operation panel. For the names of the parts of
the operation panel, please refer to section 1-1-5 Operation Panel.
2 Operation Procedure
This section describes the operation procedure for the basic wafer inspections (registered in the menu mode).
When you use any cassette or inspection wafers that are not registered in the menu
mode, you need to newly register the inspection wafer.
For registration, please refer to “2 Registration of New Inspection Wafer Types
(Cassettes to be Used and Wafer Thickness)” in “2 Adjustments” in the Maintenance
Manual (page 2-1).
The operation procedure flowchart is shown on the next page.
When selected, the Top Macro inspection, the Back Macro inspection, the 2nd Back Macro inspection and the
Microscope inspection are repeated for the number of wafers to be inspected, as shown in the flowchart.
For details of each operation, refer to the reference pages and sections listed on the right-hand side of the
flowchart.
If the wafer loader operation panel has been left untouched for about 10 seconds, it will automatically switch to
standby mode and the liquid crystal panel will darken. In the standby mode, press one of the buttons on the
operation panel (save for the Quit button, the Pause button, the Wafer No. selector button or the wafer unload
button), and the operation panel will automatically return to normal mode and accept button input.
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