Operation Manual Specifications
Specifications
1. Transferable Wafer Size
Applicable SEMI standard
SEMI M1.15-0600
Standard for 300mm Polished Mono-crystalline Silicon Wafers (Notched)
Applicable wafer diameter
300 ± 0.2 mm
Applicable wafer thickness
t = 775 ± 25 um
Applicable wafer warpage
0.1 mm or less
Applicable wafer material
Silicon
Applicable positioning shape
Notch depth :1.00 mm +0.25 mm, -0 mm,
2. Settable Cassette
Applicable cassette
FOSB (Front Opening Shipping Box)
Shin-Etsu MW300G
SEMI:M31-0999 standard
*If you use other cassettes, contact
Olympus.
:FOUP (Front Opening Unified Pods)
Shin-Etsu FOUP300EX
SEMI: E47.1-0200 standard
:FOSB (Front Opening Shipping Box)
Shin-Etsu MW300G
SEMI:M31-0999 standard
:FIMS-FOSB Miraial WINW300F
*If you use other cassettes, contact
Number of settable
cassettes
1 cassette (for both loading and unloading)
3. Macro Inspections
Top Macro inspection
Tilt drive type: Joystick direct drive
Tilt angle: 20 degrees (max.)
Wafer rotation direction: Clockwise, counterclockwise, and non-rotating
Wafer rotation speed: 3 to 30 seconds/rotation (continuously variable)
Back Macro inspection
Tilt drive type: Motorized drive
Tilt angle: 360 degrees from horizon (stepless)
Angle can be changed during inspection.
Equipped with the wafer edge holding mechanism
2nd Back Macro inspection
After the Back Macro inspection, the wafer is rotated counterclockwise about 20 degrees
and inspected again.
Inspection time setting
From 0 to 8 seconds and ∞
The ∞ setting maintains the inspection state.
Time can be set in 1 second steps.
Common time setting for the Top Macro and Back Macro inspections
4. Microscope Inspection
Applicable microscope
OLYMPUS MX61L/ MX63L
Applicable microscope stage
AL120-VS12
Microscopic observation
method
Reflected light observation only
Stage operation method
Manually-operated stage with XY coarse and fine adjustment and a 360-degree rotation
mechanism (with an X-direction coarse travel clutch)
Stage driving method
Belt drive
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