Oxford Instruments PlasmalabSystem100 - Loadlock and Wafer-Handler Pump Options

Installation Data Oxford Instruments Plasma Technology PlasmalabSystem100
Installation Data (PECVD - TEOS)
Printed: 10-Feb-11, 9:07 Page 17 of 24 Issue 10: February 11
6.2 Loadlock and wafer-handler pump options
Available
pump
options
Length
mm
Width
mm
Height
mm
Pump inlet
connection
*Pump
outlet
connection
Weight
kg
Water
cooling
Power
consumption
kW
**Minimum
N
2
purge
rate
Adixen
2015C2
462
188
240
DN 25
DN 25
27
n/a
0.45 (50Hz)
0.55 (60Hz)
2 lpm
Adixen
2033C2
701
213
348
DN 40
DN 40
76
n/a
1.1 (50Hz)
1.3 (60Hz)
2 lpm
Adixen
ACP15G
515
205
280
DN 25
DN 16
23
n/a
0.6
(50/60Hz)
5 lpm
Adixen
ACP28G
650
195
325
DN 25
DN 25
30
n/a
1.2
(50/60Hz)
1.65 lpm
Adixen
ACP40G
650
195
325
DN 40
DN 25
32
n/a
1.2
(50/60Hz)
1.65 lpm
* All fittings and pipework connected to the rotary pump exhaust must be made from industry standard
stainless steel. Refer to the OIPT Services Specifications document, sub-section 6.1.
** N2 purge recommended if corrosive gases residues are likely to be present e.g. cassette loadlocks on
chlorinated process etch systems.