Wi-Fi&Bluetooth Module Series
FC64E_Hardware_Design
52
/ 53
1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to
the air is forbidden.
2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking.
All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the
drying oven. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure.
3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules.
6.2. Manufacturing and Soldering
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean
stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the
module is recommended to be 0.15–0.18 mm. For more details, see document [4].
The peak reflow temperature should be 235–246 ºC, with 246 ºC as the absolute maximum reflow
temperature. To avoid damage to the module caused by repeated heating, it is strongly
recommended that the module should be mounted only after reflow soldering for the other side of
PCB has been completed. The recommended reflow soldering thermal profile (lead-free reflow
soldering) and related parameters are shown below.
Figure 23: Recommended Reflow Soldering Thermal Profile
Table 30: Recommended Thermal Profile Parameters
To Next Page
Loading...
Need help?
General
