Quectel FC64E - Recommended Footprint

Wi-Fi&Bluetooth Module Series
FC64E_Hardware_Design
49
/ 53
5.2. Recommended Footprint
Figure 21: Recommended Footprint (Top View)
1. Keep at least 3 mm between the module and other components on the motherboard to improve
soldering quality and maintenance convenience.
2. To keep the reliability of the mounting and soldering, keep the motherboard thickness as at least
1.2 mm.
NOTE
Pin1