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Seg
Protection Device
WI Line WIC1
Seg WI Line WIC1 User Manual
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9
Self
-Supervision
9.1
Self-Supervision
Messages
[Operation / Self
-Supervision / Messages]
This item repr
esents a special dialog. (See the T
echnical Manual for details.)
Internal messages
79
WIC1
WIC1-1.0-EN-REF
9 Self
-Supervision
9.1 Self
-Supervision
78
80
Table of Contents
Table of Contents
3
1 About This Reference Manual
7
2 Hardware
10
2.1 Device Configuration
10
2.2 DiggiMEC
12
2.2.1 DiggiMEC: Device Planning Parameters
12
2.2.2 DiggiMEC: Settings
12
3 Security
15
4 Field settings
16
4.1 CT – Current Transformer
16
4.1.1 CT: Settings
16
4.1.2 CT: Direct Controls
18
4.1.3 CT: Values
18
5 System
21
5.1 Time
21
5.2 System
22
5.2.1 System: Direct Controls
22
5.2.2 System: Values
22
6 Measured Values
24
7 Protection Parameter
25
7.1 Prot: Device Planning Parameters
25
7.2 Prot: Settings
25
7.3 Prot: Direct Controls
29
7.4 Prot: Input States
30
7.5 Prot: Signals (Output States)
30
7.6 IH2 – Module Inrush
33
7.6.1 IH2: Device Planning Parameters
33
7.6.2 IH2: Settings
33
7.6.3 IH2: Input States
34
7.6.4 IH2: Signals (Output States)
34
7.7 I> – Phase Overcurrent Stage
35
7.7.1 I>: Device Planning Parameters
35
7.7.2 I>: Settings
35
7.7.3 I>: Input States
36
7.7.4 I>: Signals (Output States)
37
7.8 I>> – Phase Overcurrent Stage
39
7.8.1 I>>: Device Planning Parameters
39
7.8.2 I>>: Settings
39
7.8.3 I>>: Input States
40
7.8.4 I>>: Signals (Output States)
41
7.9 I>>> – Phase Overcurrent Stage
43
7.9.1 I>>>: Device Planning Parameters
43
7.9.2 I>>>: Settings
43
7.9.3 I>>>: Input States
44
7.9.4 I>>>: Signals (Output States)
45
7.10 IG> – Ground (earth) current protection stage
47
7.10.1 IG>: Device Planning Parameters
47
7.10.2 IG>: Settings
47
7.10.3 IG>: Input States
48
7.10.4 IG>: Signals (Output States)
49
7.11 IG>> – Ground (earth) current protection stage
50
7.11.1 IG>>: Device Planning Parameters
50
7.11.2 IG>>: Settings
50
7.11.3 IG>>: Input States
51
7.11.4 IG>>: Signals (Output States)
52
7.12 I2/I1> – Unbalanced Load Protection
53
7.12.1 I2/I1>: Device Planning Parameters
53
7.12.2 I2/I1>: Settings
53
7.12.3 I2/I1>: Input States
54
7.12.4 I2/I1>: Signals (Output States)
54
7.13 I2> – Negative-Sequence Current Protection
55
7.13.1 I2>: Device Planning Parameters
55
7.13.2 I2>: Settings
55
7.13.3 I2>: Input States
58
7.13.4 I2>: Signals (Output States)
58
7.14 ThR – Thermal replica module
59
7.14.1 ThR: Device Planning Parameters
59
7.14.2 ThR: Settings
59
7.14.3 ThR: Direct Controls
60
7.14.4 ThR: Input States
60
7.14.5 ThR: Signals (Output States)
60
7.14.6 ThR: Values
61
7.15 Ipeak> – Peak-Value Overcurrent
62
7.15.1 Ipeak>: Device Planning Parameters
62
7.15.2 Ipeak>: Settings
62
7.15.3 Ipeak>: Input States
63
7.15.4 Ipeak>: Signals (Output States)
63
7.16 SOTF – Switch Onto Fault - Module
65
7.16.1 SOTF: Device Planning Parameters
65
7.16.2 SOTF: Settings
65
7.16.3 SOTF: Input States
66
7.16.4 SOTF: Signals (Output States)
66
7.17 ExP[1] – External Protection - Module
68
7.17.1 ExP[1]: Device Planning Parameters
68
7.17.2 ExP[1]: Settings
68
7.17.3 ExP[1]: Input States
69
7.17.4 ExP[1]: Signals (Output States)
69
7.18 ExP[2] – External Protection - Module
71
7.18.1 ExP[2]: Device Planning Parameters
71
7.18.2 ExP[2]: Settings
71
7.18.3 ExP[2]: Input States
72
7.18.4 ExP[2]: Signals (Output States)
73
7.19 CBF – Circuit breaker failure protection module
74
7.19.1 CBF: Device Planning Parameters
74
7.19.2 CBF: Settings
74
7.19.3 CBF: Input States
74
7.19.4 CBF: Signals (Output States)
74
7.20 Supervision
76
7.20.1 TCM – Trip Circuit Monitoring
76
7.20.1.1 TCM: Device Planning Parameters
76
7.20.1.2 TCM: Settings
76
7.20.1.3 TCM: Input States
76
7.20.1.4 TCM: Signals (Output States)
76
8 Records
78
8.1 Fault recorder
78
9 Self-Supervision
79
9.1 Self-Supervision
79
10 Service
80
11 Selection Lists
81
Index
102
102
C
102
D
102
E
102
F
102
I
102
L
103
M
103
N
103
O
103
P
103
R
103
S
103
T
104
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Seg WI Line WIC1 Specifications
General
Brand
Seg
Model
WI Line WIC1
Category
Protection Device
Language
English
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