Siemens SIMATIC IFP1200 Basic

Installing and connecting the device
3.1 Preparing for installation
IFP Basic
Operating Instructions, 06/2023, A5E46178354 - AD
23
For vertical installation, the following ambient temperatures are permitted:
Maximum ambient temperature at
the device
Comment
45 °C (IFP1200 Basic, IFP1500 Basic,
IFP1900 Basic)
40 °C (IFP2200 Basic)
The device must be installed in a fire protection enclosure
(see "General safety instructions (Page 13)").
50°C (IFP1200 Basic C)
The device enclosure fulfills the requirement of a fire
protection enclosure.
3.1.4 Preparing the mounting cutout
Note
Stability of the mounting cutout
The material in the area of the mo
unting cutout must provide sufficient strength to
guarantee the enduring and safe mounting of the device.
To achieve the degrees of protection described below, it must be ensured that deformation of
the material cannot occur due to the force of the mountin
g clips or operation of the device.
Degrees of protection
The degrees of protection of the device can only be guaranteed if the following requirements
are met:
• For SIMATIC IFP Basic and SIMATIC IFP1200 Basic C, in order to achieve IP65 protection
degree, the material thickness for the mounting cutout should be: 2 mm to 6 mm
• Permissible deviation from plane at the mounting cutout: ≤ 0.5 mm
This condition must be fulfilled for the mounted device.
• Permissible surface roughness in the area of the seal: ≤ 120 µm (R
z 120)