General Maintenance
Table 4-2: Internal inspection checklist (cont.)
Item Inspect for Repair action
Solder connections Cold solder or rosin joints.
Resolder joint and clean
with isopropyl alcohol.
Capacitors
Damaged or leaking cases.
Corroded solder on leads or
terminals.
Remove and replace
damaged circuit board.
Wiring and cables Loose plugs or connectors.
Burned, broken, or frayed
wiring.
Firmly seat connectors.
Repair or replace modules
with defective wires or
cables.
Chassis Dents, deformations, and
damaged hardware.
Straighten, repair, or replace
defective hardware.
Cleaning Procedure – Interior. To clean the waveform monitor interior, perform
the fol
lowing steps:
1. Blow off dust with dry, low-pressure, deionized air (approximately 9 psi).
2. Remove any remaining dust with a lint-free cloth dampened in isopropyl
alcohol (75% solution) and rinse with warm deionized water. (A cotton-tipped
appl
icator is useful for cleaning in narrow spaces and on circuit boards.)
STOP. If, after doing steps 1 and 2, a module is clean upon inspection, skip the
rema
ining steps.
3. If steps 1 and 2 do not remove all the dust or dirt, the waveform monitor
may
be spray washed using a solution of 75% isopropyl alcohol by doing
steps 4 through 6 .
4. Ga
in access to the parts to be cleaned by removing easily accessible shields
and panels.
5
.
S
pray wash dirty parts with the isopropyl alcohol and wait 60 seconds for the
majority of the alcohol to evaporate.
6. Dry all parts with low-pressure, deionized air.
Lubrication. There is no periodic lubrication required for the waveform monitor.
4–4 WFM6120, WFM7020, and WFM7120 Waveform Monitors Service Manual
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