Texas Instruments AM335x Sitara User Manual

A1
A1
X
Y
OFFSET
Recommended DDR2
Device Orientation
Y
Y
OFFSET
DDR2
Device
DDR2
Interface
AM335x
AM3359, AM3358, AM3357, AM3356, AM3354, AM3352
SPRS717H –OCTOBER 2011–REVISED MAY 2015 www.ti.com
7.7.2.2.2.4 Placement
Figure 7-41 shows the required placement for the DDR2 devices. The dimensions for this figure are
defined in Table 7-47. The placement does not restrict the side of the PCB on which the devices are
mounted. The ultimate purpose of the placement is to limit the maximum trace lengths and allow for
proper routing space. For single-memory DDR2 systems, the second DDR2 device is omitted from the
placement.
Figure 7-41. AM335x Device and DDR2 Device Placement
Table 7-47. Placement Specifications
(1)
NO. PARAMETER MIN MAX UNIT
1 X
(2)(3)
1750 mils
2 Y
(2)(3)
1280 mils
3 Y Offset
(2)(3)(4)
650 mils
4 Clearance from non-DDR2 signal to DDR2 keepout region
(5)(6)
4 w
(1) DDR2 keepout region to encompass entire DDR2 routing area.
(2) For dimension definitions, see Figure 7-41.
(3) Measurements from center of AM335x device to center of DDR2 device.
(4) For single-memory systems, it is recommended that Y offset be as small as possible.
(5) w is defined as the signal trace width.
(6) Non-DDR2 signals allowed within DDR2 keepout region provided they are separated from DDR2 routing layers by a ground plane.
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Texas Instruments AM335x Sitara Specifications

General

Brand	Texas Instruments
Model	AM335x Sitara
Category	Processor
Language	English