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5 Device Comparison

Device Comparison Table

DEVICE NAME

(1)

(4)

FLASH /

SRAM (KB)

QUAL

(2)

MATH

ACCEL

ADC /

CHAN

COMP DAC OPA GPAMP UART/I2C/SPI CAN TIMA TIMG GPIO

PACKAGE

[PACKAGE SIZE]

(3)

MSPM0G3505xPM 32 / 16

S Y 2 / 17 3 1 2 1 4 / 2 / 2 1 2 5 60

64 LQFP

[12 mm × 12 mm]

MSPM0G3506xPM 64 / 32

MSPM0G3507xPM 128 / 32

MSPM0G3505xPT 32 / 16

S Y 2 / 16 3 1 2 1 4 / 2 / 2 1 2 5 44

48 LQFP

[9 mm × 9 mm]

MSPM0G3506xPT 64 / 32

MSPM0G3507xPT 128 / 32

MSPM0G3505xRGZ 32 / 16

S Y 2 / 16 3 1 2 1 4 / 2 / 2 1 2 5 44

48 VQFN

[7 mm × 7 mm]

MSPM0G3506xRGZ 64 / 32

MSPM0G3507xRGZ 128 / 32

MSPM0G3505xRHB 32 / 16

S Y 2 / 11 3 1 2 1 4 / 2 / 2 1 2 5 28

32 VQFN

[5 mm × 5 mm]

MSPM0G3506xRHB 64 / 32

MSPM0G3507xRHB 128 / 32

MSPM0G3505xDGS28 32 / 16

S Y 2 / 11 3 1 2 1 4 / 2 / 2 1 2 5 24

28 VSSOP

[7.1 mm × 3 mm]

MSPM0G3506xDGS28 64 / 32

MSPM0G3507xDGS28 128 / 32

(1) For the most current part, package, and ordering information for all available devices, see the Package Option Addendum in Section 11, or see the TI website.

(2) Device Qualifications:

• S = –40°C to 125°C

(3) The package size (length × width) is a nominal value and includes pins, where applicable. For the package dimensions with tolerances, see Section 11.

(4) For more information about the device name, see Section 10.2

www.ti.com

MSPM0G3507, MSPM0G3506, MSPM0G3505

SLASEX6A – FEBRUARY 2023 – REVISED JUNE 2023

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