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The following information is only for EU-member states:
The mark shown to the right is in compliance with the Waste Electrical
and Electronic Equipment Directive 2012/19/EU (WEEE). The mark
indicates the requirement NOT to dispose of the equipment as
unsorted municipal waste, but use the return and collection systems
according to local law.
Declaration of RoHS2 Compliance
This product has been designed and manufactured in compliance with Directive
2011/65/EU of the European Parliament and the Council on restriction of the use
of certain hazardous substances in electrical and electronic equipment (RoHS2
Directive) and is deemed to comply with the maximum concentration values issued
by the European Technical Adaptation Committee (TAC) as shown below:
Substance Proposed Maximum
Concentration
Actual
Concentration
Cadmium (Cd) 0.01% < 0.01%
Lead (Pb) 0.1% < 0.1%
Mercury (Hg) 0.1% < 0.1%
Hexavalent Chromium (Cr6+) 0.1% < 0.1%
Polybrominated biphenyls (PBB) 0.1% < 0.1%
Polybrominated diphenyl esthers (PBDE) 0.1% < 0.1%
Bis(2-Ethylhexyl) phthalate (DEHP) 0.1% < 0.1%
Benzyl butyl phthalate (BBP) 0.1% < 0.1%
Dibutyl phthalate (DBP) 0.1% < 0.1%
Diisobutyl phthalate (DIBP) 0.1% < 0.1%
Certain components of products as stated above are exempted under the Annex
III of the RoHS2 Directives as noted below:
• Mercury in cold cathode fluorescent lamps and external electrode fluorescent
lamps (CCFL and EEFL) for special purposes not exceeding (per lamp):
» Short length (500 mm): maximum 3.5 mg per lamp.
» Medium length (> 500 mm and 1,500 mm): maximum 5 mg per lamp.
» Long length (> 1,500 mm): maximum 13 mg per lamp.
• Lead in glass of cathode ray tubes.
• Lead in glass of fluorescent tubes not exceeding 0.2% by weight.
• Lead as an alloying element in aluminum containing up to 0.4% lead by weight.
• Copper alloy containing up to 4% lead by weight.
• Lead in high melting temperature type solders (i.e. lead-based alloys containing
85% by weight or more lead).
• Electrical and electronic components containing lead in a glass or ceramic other
than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or
ceramic matrix compound.
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General
Weight and Dimensions
