140 Rockwell Automation Publication 2198-UM002G-EN-P - February 2019
Chapter 5 Connect the Kinetix 5700 Drive System
Ground Multiple Subpanels
In this figure, the chassis ground is extended to multiple subpanels.
Figure 92 - Subpanels Connected to a Single Ground Point
High-frequency (HF) bonding is not illustrated. For HF bonding information,
refer to Bonding Multiple Subpanels
on page 69.
Follow NEC and applicable
local codes.
Bonded Ground Bus
Ground Grid or Power
Distribution Ground
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