Cray CRAY-1 - Page 30

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- Dimensions
Base - approximately 9 ft diameter by 1 1/2 ft high
Columns - approximately 5 ft diameter by 6 1/2 ft high including
height
of base
-
24 chassis arranged two per column in 12 columns
- Approximately 1700 modules (16 banks); approx. 115 standard module types
-
Each module contains up to 288 IC packages per module
- Power consumption approximately 118 kw input for maximum memory size
- Refrigerant-22 cooled with refrigerant/water heat exchange
- Three
memory options
-
Weight 10,500 lbs (maximum memory size)
- Three basic chip types
5/4
NAND gates
Memory chips
Register chips
Figure 2-1. Physical organization
of mainframe
2240004
2-2
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