Deltabar PMD75B PROFINET with Ethernet-APL Technical data
Endress+Hauser 85
80176
85185
90194
95203
100212
105221
110230
85
185
71
160
57
135
T
a
[°C]
[°F]
T
p
[°C][°F]
15
59
29
84
43
109
T
p
T
a
A0043580
T
a
Maximum ambient temperature at the manifold
T
p
Maximum process temperature at the manifold
Oxygen applications (gaseous)
Oxygen and other gases can react explosively to oils, grease and plastics. The following
precautions must be taken:
• All components of the system, such as devices, must be cleaned in accordance with the
national requirements.
• Depending on the materials used, a certain maximum temperature and a maximum
pressure must not be exceeded for oxygen applications.
The cleaning of the device (not accessories) is offered as an optional service.
• p
max
: 80 bar (1 200 psi)
• T
max
: 60 °C (140 °F)
Seals
Seal Temperature Pressure specifications
FKM –20 to +85 °C (–4 to +185 °F) PN > 160 bar (2 320 psi):
T
min
–15 °C (+5 °F)
FKM
Cleaned of oil and grease
–10 to +85 °C (+14 to +185 °F) -
FKM
Cleaned for oxygen service
–10 to +60 °C (+14 to +140 °F) -
FFKM –10 to +85 °C (+14 to +185 °F) MWP: 160 bar (2 320 psi)
–25 to +85 °C (–13 to +185 °F) MWP: 100 bar (1 450 psi)
EPDM –40 to +85 °C (–40 to +185 °F) -
PTFE
1)
–40 to +85 °C (–40 to +185 °F) PN > 160 bar (2 320 psi)
Minimum process temperature: –20 °C (–4 °F)
PTFE
1)
Cleaned for oxygen applications
–20 to +60 °C (–4 to +140 °F) PN > 160 bar (2 320 psi)
Minimum process temperature: –20 °C (–4 °F)
1) For 10 mbar (0.15 psi) and 30 mbar (0.45 psi) measuring cells: in the event of consistently high pressures (≥ 63 bar (913.5 psi)) together with
low process temperatures (<–10 °C (+14 °F), use FKM, EPDM or FFKM seals.