EasyManuals Logo

Fujitsu PRIMERGY RX200 S6 Service Supplement

Fujitsu PRIMERGY RX200 S6
50 pages
To Next Page IconTo Next Page
To Next Page IconTo Next Page
To Previous Page IconTo Previous Page
To Previous Page IconTo Previous Page
Page #11 background imageLoading...
Page #11 background image
RX200 S6 Service Supplement 11
Introduction
Extensions and upgrades:
I For some components only the installation
routine is described in the Options Guide.
Removing these components proceed in
reverse order.
Expanding the main memory
Installing a second processor/replacing the
processor/replacing the heat sink
Installing accessible drive
Installing additional HDD cage
Installing expansion cards
Installing iBBU
Installing TPM
Installing UFM
Options Guide
Cabling
Replacement routines:
Replacing the LED board
Replacing the TPM
Replacing the UFM
Replacing the HDD backplane
Replacing the power-distribution module
Replacing a riser card
Replacing the system board
Service Supplement
Board layout
BIOS setup "D3031 BIOS Setup
Utility for RX200 S6"
manual
Information/procedure Manual
Table 1: Overview of the documentation RX200 S6

Other manuals for Fujitsu PRIMERGY RX200 S6

Questions and Answers:

Question and Answer IconNeed help?

Do you have a question about the Fujitsu PRIMERGY RX200 S6 and is the answer not in the manual?

Fujitsu PRIMERGY RX200 S6 Specifications

General IconGeneral
Tcase77.6 °C
Bus typeQPI
SteppingB1
FSB ParityNo
Processor codeSLBV4
Processor cache12 MB
Processor cores4
Processor modelE5620
System bus rate5.86 GT/s
Processor seriesIntel Xeon 5600 Series
Processor socketSocket B (LGA 1366)
Processor threads8
Processor codenameWestmere EP
Motherboard chipsetIntel® 5500
Number of QPI links2
Processor frequency2.4 GHz
Processor cache typeSmart Cache
Processor lithography32 nm
Processor manufacturerIntel
Processor package size42.5 X 45 mm
Processor front side bus- MHz
Processor boost frequency2.66 GHz
Processor operating modes64-bit
ECC supported by processorYes
Supported instruction setsSSE4.2
Thermal Design Power (TDP)80 W
Number of processors installed1
CPU multiplier (bus/core ratio)18
Physical Address Extension (PAE)40 bit
Memory types supported by processorDDR3 800/1066
Memory channels supported by processorTriple
Memory clock speeds supported by processor800, 1066 MHz
Memory bandwidth supported by processor (max)25.6 GB/s
Maximum internal memory supported by processor288 GB
HDD size2.5 \
RAID levels1, 5, 6
HDD capacity146 GB
HDD interfaceSerial Attached SCSI (SAS)
Optical drive type-
Total storage capacity292 GB
Memory slots12
Internal memory4 GB
Memory clock speed1066 MHz
Internal memory typeDDR3-SDRAM
Maximum internal memory192 GB
Maximum graphics card memory32 MB
LAN controllerIntel® 82575EB
USB 2.0 ports quantity7
Ethernet LAN (RJ-45) ports3
Drive bays8 x 2.5 \
Size (imperial)19 \
Dimensions (WxDxH)482.6 x 765 x 43 mm
Motherboard manufacturerD 3031
Recommended humidity operating range10 - 85 %
Recommended operating temperature range (T-T)10 - 35 °C
Power supply type47 - 63 Hz
Power requirements100 - 127 V / 200 - 240 V
Power consumption (typical)770 W
Power supply input frequency50 Hz
Compatible operating systemsMicrosoft Windows Server 2008 Microsoft Windows Server 2008 R2 (Hyper-V) Under Hyper-V are (et al): - Windows Server 2008 R2 - Windows Server 2008 - Windows Server 2003 - Windows Server 2000 Microsoft Windows Server 2003 R2 Novell SUSE Linux Enterprise Server Red Hat Enterprise Linux Citrix XenServer VMware Infrastructure VMware vSphere 4.0
Management platformiRMC S2
Chassis typeRack (1U)
CertificationISO 7779; ISO 9296
Processor ARK ID47925
Intel® Turbo Boost Technology1.0
Weight and Dimensions IconWeight and Dimensions
Weight17000 g

Related product manuals