Table of Contents System
Page 4 of 110 HI 803 211 E Rev. 1.01.00
4.2.2.2 5 V Power Supply for Extension Racks 34
4.2.2.3 24 V Auxiliary Voltages for I/O Modules and I/O Processing Module 35
4.2.3 Extension Rack Backplane 36
4.2.4 Temperature Monitoring 37
4.3 Power Supply 38
4.3.1 Mono H51X Base Rack (24 VDC) 41
4.3.2 Redundant H51X Base Rack (24 VDC) 42
4.3.3 Redundant H51X Base Rack and I/O Level (24 VDC) 43
4.3.4 H51X Base Rack (24 VDC) I/O Level via F-PWR 02 Buffer Modules (Optional) 44
4.3.5 Mono H41X Base Rack (24 VDC) 45
4.3.6 Redundant H41X Base Rack (24 VDC) 46
4.3.7 24 V Distribution for HIQuad X 47
4.3.7.1 5 V Distribution for HIQuad X 48
4.3.7.2 5 VDC Distribution for H51X 48
4.3.7.3 5 VDC Distribution for H41X 50
4.3.8 5 VDC Additional Power Supply (H51X) 51
4.4 System Bus 51
4.5 I/O Bus 52
4.6 I/O Watchdog (WD) 52
4.7 Modules 53
4.8 F-CPU 01 Processor Module 53
4.8.1 Operating System 53
4.8.1.1 General Cycle Sequence 53
4.8.1.2 Operating System States 53
4.8.2 Behavior in the Event of Faults 56
4.9 F-IOP 01 I/O Processing Module 57
4.10 F-COM 01 Communication Module 57
4.11 I/O Modules 58
4.11.1 Scope of Application of the I/O Modules 58
4.11.2 Mounting Position 58
4.12 Noise Blanking 59
4.12.1 Effects of Noise Blanking 59
4.12.2 Configuring Noise Blanking 59
4.12.3 Noise Blanking Sequence 60
4.12.4 Effective Direction of Noise Blanking 62
4.12.4.1 Effective Direction from the Input Module to the Processor Module (3) 62
4.12.4.2 Effective Direction from the Processor Module to the Output Module (4) 62
4.12.4.3 Effective Direction from the Processor Module to the Output Module (7) 62
4.13 Communication 63
4.13.1 Licensing 63
4.14 Connecting the PADT to the System 63
4.15 Licensing 64
5 Redundancy 65
5.1 Processor Module Redundancy 65
5.1.1 Reducing Redundancy 65
5.1.2 Increasing Redundancy 65
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