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HP 200 G4 22

HP 200 G4 22
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6. Thoroughly clean the thermal material from the surfaces of the heat sink and the system board
components each time the heat sink is removed. Replacement thermal material is included with the heat
sink and system board spare part kits.
Thermal paste is used on the heat sink (1) and associated system board component (2).
To install the heat sink, reverse the removal procedure.
34 Chapter 4 Removal and replacement procedures

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