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HP ProLiant ML30 Gen10 User Manual

HP ProLiant ML30 Gen10
251 pages
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4.11.2 HPE Smart Storage Hybrid Capacitor
4.11.2.1 Minimum firmware versions
4.11.3 Installing an energy pack
4.12 Expansion board options
4.12.1 Expansion board thermal requirement
4.12.2 Installing an expansion board
4.13 Internal USB device option
4.13.1 Installing an internal USB device
4.14 HPE Trusted Platform Module 2.0 Gen10 option
4.14.1 Overview
4.14.2 HPE Trusted Platform Module 2.0 guidelines
4.14.3 Installing and enabling the HPE TPM 2.0 Gen10 option
4.14.3.1 Installing the Trusted Platform Module board
4.14.3.1.1 Preparing the server for installation
4.14.3.1.2 Installing the TPM board and cover
4.14.3.1.3 Preparing the server for operation
4.14.3.2 Enabling the Trusted Platform Module
4.14.3.2.1 Enabling the Trusted Platform Module as TPM 2.0
4.14.3.2.2 Enabling the Trusted Platform Module as TPM 1.2
4.14.3.3 Retaining the BitLocker recovery key/password
5 Cabling
5.1 Cabling guidelines
5.2 Storage cabling
5.2.1 LFF non-hot-plug drive cabling from the media bay
5.2.2 LFF non-hot-plug drive cabling from the drive cage
5.2.3 LFF hot-plug drive cabling
5.2.4 SFF hot-plug drive cabling
5.3 Energy pack cabling
5.4 Controller backup power cabling
5.5 Media device cabling
5.5.1 SATA optical drive cabling
5.5.2 SAS LTO tape drive cabling
5.5.3 USB RDX drive cabling
5.6 Serial port cabling
5.7 Fan cabling
5.8 Power supply cabling
5.9 Front I/O cabling
5.10 Front USB cabling
6 Software and configuration utilities
6.1 Server mode
6.2 Product QuickSpecs
6.3 Active Health System Viewer
6.3.1 Active Health System
6.3.1.1 Active Health System data collection

Table of Contents

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HP ProLiant ML30 Gen10 Specifications

General IconGeneral
Bus typeDMI3
Tjunction100 °C
Scalability1S
Processor cache8 MB
Processor modelE-2124
System bus rate8 GT/s
Processor socketLGA 1151 (Socket H4)
Processor threads4
Processor codenameCoffee Lake
Execute Disable BitYes
Processor frequency3.3 GHz
Processor cache typeSmart Cache
Processor lithography14 nm
Processor manufacturerIntel
Processor package size37.5 x 37.5 mm
Processor boost frequency4.3 GHz
Processor operating modes64-bit
Embedded options availableNo
PCI Express configurations1x16, 2x8, 1x8+2x4
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
Thermal Design Power (TDP)71 W
Number of processors installed1
Maximum number of PCI Express lanes16
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2666 MHz
Memory bandwidth supported by processor (max)41.6 GB/s
Maximum internal memory supported by processor128 GB
On-board graphics card model-
Internal memory8 GB
Maximum internal memory64 GB
Memory layout (slots x size)1 x 8 GB
HDD size- \
Supported HDD sizes3.5 \
Total storage capacity0 GB
Maximum storage capacity- TB
Number of HDDs installed0
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Ethernet LAN (RJ-45) ports2
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity5
Chassis typeTower (4U)
Product colorBlack
Power supply350 W
Ethernet interface typeGigabit Ethernet
PCI Express slots version3.0
Processor ARK ID134856
Intel Secure Key Technology version1.00
Weight and Dimensions IconWeight and Dimensions
Depth475 mm
Width175 mm
Height368.3 mm

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